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Altera unveils Stratix IV E FPGA development kits 12/7/2009 Altera announced the availability of its latest development kit targeting Stratix IV FPGAs. U.S goverment to add more fundings for Green-Technology R & D 12/7/2009 The U.S. government will provide more funds for battery research and accelerate some green technology patent applications as part of a set of announcements made days before the United Nations Climate Change Conference in Copenhagen. Intel to delay release of its High-end Graphic chip 12/7/2009 Intel said it will not release its first implementation of Larrabee, a multi-core x86 processor geared for consumer graphics and technical computing applications. FTC approached Nvidia about Intel's business practices 12/4/2009 In addition to the AMD probe, the FTC has approached Nvidia about Intel's business practices. This time in the graphics chip market, according to sources familiar with the matter. An Nvidia spokesperson would not comment. The Nvidia-related probe was reported by BusinessWeek. Acer replaces Dell as number two PC maker 12/4/2009 Acer replaced Dell to rank second in units shipped in the global PC market, making Acer the first Asian computer maker to rank that high in quarterly results, according to market researchers iSuppli. Samsung to keep growing its foundry business 12/4/2009 Samsung plans to double its production of chips for others, so-called foundry production, every year until it rivals market leader Taiwan Semiconductor Manufacturing Co. Ltd., according to a Chosun Ilbo report that referenced an un-named company spokesman as its source. Micron unveiled SATA 6 Gb/s SSD 12/3/2009 Micron Technology introduced a solid-state drive for PCs that leverages the fastest available SATA interface, which provides a dramatic boost to read/write speeds. Samsung to allocate $6 billion for fab expansion in 2010, sources said 12/3/2009 Samsung Electronics Co. Ltd. is planning to spend around 7 trillion won (about $6 billion) on expanding its semiconductor business in 2010, according to a Korea Herald report that cited an un-named source. ASUS New Netbook to use Sandisk SSD 12/3/2009 SanDisk Corp has announced that ASUS has selected the 32-Gbyte SanDisk pSSDTM Gen2 drive for its new Eee PCTM multi-touch netbook computer. Broadcom to spent $178 million buying Dune Networks 12/2/2009 Fabless chip vendor Broadcom Corp. plans to acquire Dune Networks, a developer of solutions for data center networking equipment, in a deal worth $178 million, the company said. Samsung touchscreen devices business is flourishing 12/2/2009 Samsung said it's on track to beat its sales estimates for this year thanks to a strong demand for touchscreen devices. Netlist said patent infringement lawsuit brought by Inhpi is "without merit" 12/2/2009 Memory subsystem vendor Netlist Inc. Tuesday responded to a patent infringement suit filed by rival Inphi Corp., saying through a statement that the suit is "without merit and will fail in court." Analyst revises 2009 chip forecast on surprising strong October sales 12/1/2009 Bruce Diesen, analyst with Carnegie ASA (Oslo, Norway), has raised his forecast for the 2009 chip market, for the second month in a row. Carnegie asserts the market will still be down but the shrink will be less than Carnegie previously predicted. Samsung has begun 30nm MLC NAND flash mass production 12/1/2009 Samsung Electronics Co. Ltd. has begun volume production of 3-bit, multi-level-cell (MLC) NAND flash chips using a 30-nm manufacturing process technology. DRAM sales show resilence in 2009 12/1/2009 South Korea's Samsung Electronics Co. Ltd. is the only top 10 semiconductor supplier expected to show an increase in chip sales this year compared to 2008, according to preliminary 2009 semiconductor supplier rankings released Monday (Nov. 23) by market research firm iSuppli Corp. TSMC's fab in Shanghai to manufacture automotive-grade chips 11/30/2009 TSMC plans to launch what it says will be the automotive industry's first process qualification specification and service package for automotive-grade semiconductor manufacturing in China. Infineon, Nokia work on next generation broadband chips 11/30/2009 Infineon said it is teaming with Nokia to create chips for the next generation of mobile broadband. Apple manipulates NAND prices by playing demand supply cycle?? 11/30/2009 Consumer electronics giant Apple Inc. is being accused of using its commanding purchasing position to manipulate NAND flash memory prices, according to a Korea Times article. Nokia to cut jobs in Japanese R & D center 11/25/2009 Nokia said that it will be reducing its R&D activities and will cut about 220 employees in Japan. US Patent office rejects Rambus patents 11/25/2009 The U.S. Patent and Trademark Office has rejected all 17 claims in three Rambus patents that the company asserted against Nvidia in a complaint filed with the U.S. International Trade Commission (ITC). Flat Third Quarter sale for semiconductor equipments. 11/25/2009 The strong recovery in equipment bookings seen throughout the third quarter of 2009, flattened in the first month of the fourth quarter, according to SEMI’s latest Book-to-Bill Report for October. Gartner revises Semiconductor forecast 11/24/2009 Worldwide semiconductor revenue is on now expected to reach US$226 billion in 2009, an 11.4% decline from 2008 revenue of US$255 billion. Elpida opens Munich-Germany Test Lab 11/24/2009 Elpida Memory officially opened its German High Speed DRAM Test Laboratory.President and CEO Yukio Sakamoto was welcomed by the Bavarian Ministry of Economic Affairs. Hynix increase volume of 41nm & 48nm Nand Flash Devices 11/24/2009 Hynix has smoothly produced NAND flash based on 41nm and 48nm processes with supply volumes in the second half of 2009 to double those in the first half LG to ship 7.5 Million LCD TV in 2010 11/24/2009 LG current goal for 2009 is 17 million units and is expected to increase to 25 million units in 2010.  572  |  573  |  574  |  575  |  576  |  577  |  578  |  579  |  580  |  581

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