|
|
|
Elpida develops 3D Stacked Memory Chip |
9/8/2009 |
Elpida Memory said it has developed a copper through-silicon via technology (Cu-TSV) and applied it to an 8-Gbit DRAM with vertical connections among eight memory die and an interface chip.
|
|
|
VIA revenue continues to free-fall |
9/3/2009 |
VIA Technologies has posted revenues of NT$365 million (US$11.09 million) for August, a drop of 11.38% on month and 49.94% on year.
|
|
|
Foxconn to buy Sony 's TV Plant |
9/1/2009 |
Sony has announced that it will form a strategic alliance with Taiwan's Foxconn Electronics for the production of LCD TVs for the Americas market.
|
|
|
India will Auction 3G Licenses |
8/28/2009 |
A specially constituted group of ministers in India has targeted Indian rupees 250 billion (US$5 billion) as the minimum revenue from a proposed auction of 3G and WiMax licenses in the country, according to media reports.
|
|
|
Asustek expects third-quarter revenues increase 20% |
8/27/2009 |
Asustek Computer expects its consolidated revenues for third-quarter 2009 to increase by more than 20% sequentially as the company's shipments are picking up in China, Russia and some countries in Eastern Europe, according to president Jerry Shen, speaking at August 25 investors conference.
|
|
|
|