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45nm production ramps up at Intel Fab 32 10/25/2007
''The opening of Fab 32 in Arizona today is a testament to Intel's continued investment in our most strategic asset -- the most advanced, environmentally friendly manufacturing network in the world,'' said Paul Otellini.
Taiwan to build next generation LCD plant 10/25/2007
AU, which supplies panels to Dell Inc and Hewlett-Packard Co , plans to build a next-generation LCD plant to meet new demand for growing flat TVs, and will decide what technology it will use to make panels by the end of the year.
Transmeta to be paid $250M from Intel 10/25/2007
The agreement will grant Intel a perpetual non-exclusive license to all Transmeta patents and patent applications, including any patent rights later acquired by Transmeta, now existing or as may be filed during the next ten years.
Industry leaders predict bottoming in DRAM prices 10/24/2007
Transcend company chairman Peter Su indicated that DRAM prices should be edging to a bottom with a critical drop unlikely to be seen. Citing an historical pattern, demand is expected to be strong in October and November at retail markets.
ChipPAC opens new plant in Shanghai 10/24/2007
STATS ChipPAC Ltd. today announced the grand opening of a second 371,000-square-foot manufacturing facility in Shanghai, China. The company, which claims to be the largest full turnkey assembly and test service provider in China
California fire close electronic plants 10/24/2007
Facilities were set to remain closed at least until Wednesday, and the timing for their reopening will be decided based on progress in containing the fires.
German judge: Nokia need not file another complaint against Qualcomm 10/24/2007
Nokia wanted the German court to rule Qualcomm's patents are exhausted and that it should not be able to charge twice for its patents, billing first chipset suppliers and then also handset makers.
IBM works with MediaTek on fast home wireless 10/23/2007
The new technology will allow consumers to get rid of the wires needed to connect HD-TVs to set top boxes. IBM and MediaTek said they integrate IBM's millimeter wave (mmWave) radio chips, antenna and package technology with MediaTek's digital baseband and video processing chip designs.
Elpida exchange DRAM technology with UMC 10/23/2007
Elpida and UMC said the collaboration joins Elpida's technology with UMC's advanced copper low-k processes and technology development. UMC will license to Elpida its copper low-k technology for Elpida's production and Elpida will permit UMC to offer DRAM as part of its advanced SoC solutions.
TI profit up 10% 10/23/2007
TI said analog sales increased strongly during the just ended quarter and manufacturing process improvements helped to lift gross profit margin to 54.2 percent compared with 51.4 percent in the 2006 third quarter.
Apple lifted profit with 1.39million iPhones 10/23/2007
Apple said it shipped 1.12 million iPhones during the quarter, bringing the total sold since the wireless handsets were introduced to 1.39 million units.
PQI to expand GPS investment in China 10/22/2007
PQI said the China subsidiary will invest in the development of in-car entertainment system devices. The China-based subsidiary sells its GPS devices under the brand PQ2.
700MHz band to be opened with handset choices 10/22/2007
"This would allow consumers to use the handset of their choice and download and use the applications of their choice in this spectrum block, subject to certain reasonable network-management conditions that allow the licensee to protect the network from harm,"
Qualcomm requests judge to drop infringement case 10/22/2007
Qualcomm said that Administrative Law Judge Paul Luckern recommended terminating the latest investigation because the companies are already in arbitration proceedings related to their 2001 technology license agreement.
US loosen control on Semi-equipments export to China 10/22/2007
Being designated by the U.S. government as a validated end-user means individual export licensing requirements will be removed on shipments of controlled items to the five companies. In return, the companies agreed to on-site audits by U.S. officials.
Elpida adopts larger wafer to reduce chip cost 10/19/2007
Elpida Memory will start producing DRAM chips using only advanced 300mm silicon wafers in March 2008 to lower per-chip costs in a race against tumbling price falls.
Elpida revenue slide due to shrinking dram price 10/19/2007
Elpida Memory said its first half operating profit likely fell 62 percent due to sinking price of PC memory chips and warned that prices could remain low in the second half.
AMD reports 3Q revenue 10/19/2007
AMD has reported its third quarter 2007 revenues were US$1.63 billion, an 18% increase compared to the second quarter and a 23% improvement compared to the third quarter of 2006.
Rexchip opens first 300mm Fab 10/18/2007
Rexchip Electronics has recently opened its first 300mm fab at the Central Taiwan Science Park Houli Site.
Acer have completed merging Gateway 10/18/2007
Acer has completed the merger of its wholly owned subsidiary with Gateway.
Intel to phase out Single Core CPU 10/18/2007
Intel will cease producing single-core processors for desktops in first quarter of 2008 with the launch of an entry-level dual-core series, the Celeron E1000, according to sources at PC makers.
Intel to extend support for embedded Q35 chipset 10/17/2007
Intel has announced it will provide extended life-cycle support for embedded and communication products based on its Q35 chipset.
Apple to ship new Leopard OS 10/17/2007
Apple has announced that its Mac OS X version 10.5 Leopard will finally hit the shelves of its retail stores and authorized resellers on October 26.
Seagate to ship notebook hybrid drive 10/17/2007
Seagate Technology will begin to ship its Momentus 5400 PSD, its first hybrid hard disk (HHD) for use in notebook PCs, in October 2007..
ADATA cancels investor meeting 10/16/2007
A-Data Technology has cancelled its schedule investor meeting followed by possible poor third-quarter earnings.
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