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JEDEC Standard group creates new eMMC spec for Flash cards 9/14/2007
Endorsing the proposed spec are Micron Technology, Inc., Nokia, Samsung Electronics, Sony Ericsson, Spansion Inc., STMicroelectronics and Texas Instruments. The UFS standard is expected to be completed in 2009.
300mm production cross over to occur 2008 9/13/2007
According to SEMI, the crossover, when 300mm capacity exceeds 200mm capacity will occur in 2008.
Main stream DRAM to transition from 512Mbit to 1Gbit 9/13/2007
A senior official of Samsung Electronics said, “We are planning to increase the proportion of 68 nanometer 1GB DRAM production to 30~40% by the end of this year. Also, in the first half of next year, 1GB DRAM production will become the main unit, accounting for more than 50% of the total manufacturing volume.
IBM promise single SOI chip mobile phone 9/13/2007
IBM Corp. today unveiled CMOS 7RF silicon on insulator (SOI), a semiconductor manufacturing process aimed at allowing single-chip radio frequency (RF) devices through the integration of multiple RF/analog functions such as multi-mode/multi-band RF switches, complex switch biasing networks, and power controllers.
SEC cracks down on accounting fraud 9/13/2007
The United States' governmental authorities continue to crack down on various forms of accounting fraud within the tech industry.
Samsung moves to 60nm on DDR2 9/12/2007
It will start mass production of the new DDR2 DRAMs, which boast faster data-processing speed and consume less power than ordinary DRAMs.
Samsung's semi chief to look for Flash partnership in Taiwan 9/12/2007
Samsung is trying to prevent a repeat of previous NAND flash oversupply and price slumps sparked by decreased orders from Apple, the sources added.
Turbulence detection system being tested 9/12/2007
Alerts are sent to pilots giving them advance notice and presenting alternative routes that enable pilots to thread paths between turbulent regions without changing their arrival times.
Infineon starts gradual withdraw from Qimonda 9/12/2007
Infineon has submitted an offer to sell 25 million ADSs from its own shareholdings, with an additional option of up to 3.75 million additional ADSs.
300mm Flash fab to start production in December 9/11/2007
Latest 300mm wafer fabrication facility is expected to start mass production in December 2007 and reach a production capacity of 80,000 wafers a month in the second half of 2008
iPhone will evolve into 3G 9/11/2007
There is no doubt a 3G version of Apple's iPhone could be announced soon. There is also speculation that Apple will announce the Wideband-CDMA 3G capable version of the phone when it finally reveals European launch of the handset.
Counterfeit handset runs wild in China 9/11/2007
BDA estimates the illegitimate-handset market in China at 20 million units, or roughly 15 percent of the handsets sold in the country in 2006. At iSuppli, the estimates are higher: Teng puts the 2007 gray market at 60 million units.
AMD delivers Barcelona quad core 9/11/2007
AMD, meanwhile, claims Barcelona provides a 50 percent performance increase over its own dual-core chips. Compared with Intel's previous Xeon 5345 CPUs, AMD said, Barcelona delivers performance boosts of 7 to 70 percent, depending on the application.
Hynix achieved 48GB Flash on MCP 9/10/2007
Hynix Semiconductor has reportedly developed a 1.4-millimeter thick multi-chip package (MCP) with 24 stacked NAND flash memory chips.
Taiwan quakes damaged undersea cable 9/10/2007
Chunghwa Telecom, Taiwan's top telecommunications carrier, said an undersea cable to Japan was damaged and was under repair.
China narrows down to 2 mobile TV standards 9/10/2007
CMMB is based on a hybrid satellite and terrestrial network, originally developed by China's Academy of Broadcast Science and Sarft. TDMB is a mobile TV standard using China's home-grown 3G mobile telecommunication standard, TD-SCDMA
Intel starts construction on Dalian Fab 9/10/2007
Intel's China fab was originally announced in March. The $2.5 billion project is set to be operational in 2010. Fab 68 will cover 163,000-square-meters of factory space and host a 15,000-square-meter clean room.
Hynix sells fab equipment from its China Fab 9/7/2007
Hynix Semiconductor has signed a contract to sell the equipment in its 200-mm fab in Wuxi,China.
TI introduce new DLP chipset - codename Darkchip 4 9/7/2007
Texas Instruments (TI) recently announced the introduction of a new chipset, the DarkChip 4, for DLP (digitial lighting process) products.
Macronix to outsourced more Mask Rom Production 9/7/2007
Macronix International Company (MXIC) expects the growth in outsourcing of its Mask ROM production will help an observed tight NOR flash supply.
VIA technology announce poor august revenue 9/7/2007
VIA Technologies has announced August revenues of NT$1.28 billion (US$38.75 million), a drop of 5.33% on month and 15% on year
Taiwan 's Hsinchu Park spared by morning Earthquake 9/7/2007
An earthquake with a magnitude of 6.5 on the Ritcher scale as recorded by the US Geological Survey that shook Taiwan early this morning did not affect operations of the Hsinchu Science Park
Japan to Appeals Hynix DRAM Tariff Dispute 9/6/2007
The Japanese Ministry of Economy, Trade and Industry (METI) appealed the case concerning Japan's tariff on Hynix 's DRAM products to the WTO.
AMD, Qimonda in joint chip simulation project 9/6/2007
AMD and Qimonda have launched a joint chip simulation project for 32nm CMOS and beyond.
Apple unveil new iPod 9/6/2007
Apple unveiled it's new 8mm-thin iPod touch, which features a widescreen display with a multi-touch user interface that was first introduced on Apple's iPhone.
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