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More price pressure expected on PC silicons |
9/14/2007 |
Price is expected to remain aggressive throughout the end of this year, projecting that just before Christmas, buyers will be able to purchase a dual-core MPU for less than $100.
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PC overall market to increase |
9/14/2007 |
Strong growth during Q2 showed not only relentless adoption of consumer portable PCs, but also gains in desktop and commercial markets.
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Qualcomm stay court decision on import ban |
9/14/2007 |
The wireless chip supplier said the U.S. Court of Appeals for the Federal Circuit's stay pending appeal would allow third parties such as Motorola Inc, Samsung Electronics and LG Electronics MobileComm U.S.A. Inc to import certain handsets into the United States.
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Main stream DRAM to transition from 512Mbit to 1Gbit |
9/13/2007 |
A senior official of Samsung Electronics said, “We are planning to increase the proportion of 68 nanometer 1GB DRAM production to 30~40% by the end of this year. Also, in the first half of next year, 1GB DRAM production will become the main unit, accounting for more than 50% of the total manufacturing volume.
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IBM promise single SOI chip mobile phone |
9/13/2007 |
IBM Corp. today unveiled CMOS 7RF silicon on insulator (SOI), a semiconductor manufacturing process aimed at allowing single-chip radio frequency (RF) devices through the integration of multiple RF/analog functions such as multi-mode/multi-band RF switches, complex switch biasing networks, and power controllers.
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SEC cracks down on accounting fraud |
9/13/2007 |
The United States' governmental authorities continue to crack down on various forms of accounting fraud within the tech industry.
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Samsung moves to 60nm on DDR2 |
9/12/2007 |
It will start mass production of the new DDR2 DRAMs, which boast faster data-processing speed and consume less power than ordinary DRAMs.
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Turbulence detection system being tested |
9/12/2007 |
Alerts are sent to pilots giving them advance notice and presenting alternative routes that enable pilots to thread paths between turbulent regions without changing their arrival times.
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300mm Flash fab to start production in December |
9/11/2007 |
Latest 300mm wafer fabrication facility is expected to start mass production in December 2007 and reach a production capacity of 80,000 wafers a month in the second half of 2008
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iPhone will evolve into 3G |
9/11/2007 |
There is no doubt a 3G version of Apple's iPhone could be announced soon. There is also speculation that Apple will announce the Wideband-CDMA 3G capable version of the phone when it finally reveals European launch of the handset.
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Counterfeit handset runs wild in China |
9/11/2007 |
BDA estimates the illegitimate-handset market in China at 20 million units, or roughly 15 percent of the handsets sold in the country in 2006. At iSuppli, the estimates are higher: Teng puts the 2007 gray market at 60 million units.
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AMD delivers Barcelona quad core |
9/11/2007 |
AMD, meanwhile, claims Barcelona provides a 50 percent performance increase over its own dual-core chips. Compared with Intel's previous Xeon 5345 CPUs, AMD said, Barcelona delivers performance boosts of 7 to 70 percent, depending on the application.
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Hynix achieved 48GB Flash on MCP |
9/10/2007 |
Hynix Semiconductor has reportedly developed a 1.4-millimeter thick multi-chip package (MCP) with 24 stacked NAND flash memory chips.
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China narrows down to 2 mobile TV standards |
9/10/2007 |
CMMB is based on a hybrid satellite and terrestrial network, originally developed by China's Academy of Broadcast Science and Sarft. TDMB is a mobile TV standard using China's home-grown 3G mobile telecommunication standard, TD-SCDMA
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Intel starts construction on Dalian Fab |
9/10/2007 |
Intel's China fab was originally announced in March. The $2.5 billion project is set to be operational in 2010. Fab 68 will cover 163,000-square-meters of factory space and host a 15,000-square-meter clean room.
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