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Macronix plans US Delisting 9/24/2007
Macronix International plans to delist from the Nasdaq stock exchange in the United States.
Ex-CEO of Infineon to head Grace Semi 9/21/2007
Ulrich Schumacher, former CEO of Infineon Technologies AG who left the company about three years ago, has taken on the positions of president and CEO at foundry Grace Semiconductor Manufacturing Corp.
Acer sees more consolidation in PC market 9/21/2007
The personal computer industry is in for a wave of consolidation and there will only be room in the market for a few major players, Acer President Gianfranco Lanci said.
Sharp buys 30 million shares of Pioneer 9/21/2007
Sharp Corp. will buy about $357 million worth of new shares from Pioneer Corp. to form alliances and respond to increasing shareholder pressure for better returns.
DRAM, NAND flash prices under pressure 9/20/2007
A-Data Technology said that both DRAM and NAND flash pricing will turn to worse in the next few months, according to a source familiar with the company.
Sprint to roll out WiMax coverage in 30 US cities 9/20/2007
Sprint Nextel said it expects to have WiMax available in "30ish" U.S. markets covering a population of 100 million people about the same time Intel releases its next-generation mobile chipset that will embed the wireless technology in notebooks.
Spansion starts MirrorBit chip using 65nm process 9/20/2007
Spansion announced today it has started production of MirrorBit technology at 65-nm process technology on 300-mm wafers at its Spansion 1 (SP1) facility in Aizu-Wakamatsu, Japan and plans reach high volume production by the end of the year.
Intel to deliver Wimax chip by 2008 9/19/2007
Intel said it is keeping its promise to deliver WiMax-Wi-Fi chip in mid-2008 that would support 25-watt Intel Penryn mobile processors.
iPhone to be in Germany by November 9/19/2007
Deutsche Telekom AG's T-Mobile division will sell Apple's iPhone in Germany in November, company officials said Wednesday.
Intel Larrabee chip to include high-graphics capability 9/19/2007
Intel's Larrabee processor, which the company plans to demonstrate next year, will take the chipmaker into the high-graphics market
USB 3.0 to deliver 4Gbits/s 9/19/2007
Intel Corp. announced it is working with a handful of companies on a specification that could push the USB's theoretical throughput beyond 4 Gbits/second, ten times its current rate.
Renesas IPO remains unknown 9/18/2007
The target date of Renesas Technology Corp. initial public offering (IPO) remains unknown.
AMD introduces triple-Core processor 9/18/2007
Advanced Micro Devices announced plans to ship in the first quarter of next year a triple-core processor for the desktop.
Samsung invest in multi-core DSP firm 9/18/2007
Samsung invests $27 million in the D-round for funding fabless chip vendor picoChip (Bath, England).
Non Profit group raised laptop price to $188 9/17/2007
The One Laptop per Child Foundation's XO laptop price has been rasied to $188 from its original planned $100 price tag, said foundation spokesman George Snell.
NAND flash contract prices fall 9/17/2007
NAND flash contract prices dropped in September for the first time since June, said DRAMeXchange.
Flash memory makers charged with price fixing 9/17/2007
A class action suit has been filed against SanDisk Corp. and 23 other companies over alleged price fixing for NAND flash memory devices in the market.
Microsoft antitrust appeal rejected by European court 9/17/2007
Microsoft suffered a major setback in Europe as the Luxembourg-based European Court of First Instance rejected almost all the substantive arguments in its its appeal to annul the antitrust decision made in 2004 by the European Commission.
More price pressure expected on PC silicons 9/14/2007
Price is expected to remain aggressive throughout the end of this year, projecting that just before Christmas, buyers will be able to purchase a dual-core MPU for less than $100.
PC overall market to increase 9/14/2007
Strong growth during Q2 showed not only relentless adoption of consumer portable PCs, but also gains in desktop and commercial markets.
Qualcomm stay court decision on import ban 9/14/2007
The wireless chip supplier said the U.S. Court of Appeals for the Federal Circuit's stay pending appeal would allow third parties such as Motorola Inc, Samsung Electronics and LG Electronics MobileComm U.S.A. Inc to import certain handsets into the United States.
JEDEC Standard group creates new eMMC spec for Flash cards 9/14/2007
Endorsing the proposed spec are Micron Technology, Inc., Nokia, Samsung Electronics, Sony Ericsson, Spansion Inc., STMicroelectronics and Texas Instruments. The UFS standard is expected to be completed in 2009.
300mm production cross over to occur 2008 9/13/2007
According to SEMI, the crossover, when 300mm capacity exceeds 200mm capacity will occur in 2008.
Main stream DRAM to transition from 512Mbit to 1Gbit 9/13/2007
A senior official of Samsung Electronics said, “We are planning to increase the proportion of 68 nanometer 1GB DRAM production to 30~40% by the end of this year. Also, in the first half of next year, 1GB DRAM production will become the main unit, accounting for more than 50% of the total manufacturing volume.
IBM promise single SOI chip mobile phone 9/13/2007
IBM Corp. today unveiled CMOS 7RF silicon on insulator (SOI), a semiconductor manufacturing process aimed at allowing single-chip radio frequency (RF) devices through the integration of multiple RF/analog functions such as multi-mode/multi-band RF switches, complex switch biasing networks, and power controllers.
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