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| Intel to reopens Israel Fab |
9/25/2007 |
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Intel plans to re-open its chip factory(Fab-8) in Jerusalem, Israel, after its plans to close the fab in Janurary 2007.
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| Samsung fab not affected by Power Outage |
9/24/2007 |
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Samsung Electronics said all its semiconductor production lines were operating normally after a brief power problem at its main chip plant complex near Seoul, South Korea.
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| Virtium rolls out VLP DDR3 ECC SO-DIMM memory modules |
9/24/2007 |
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Virtium Technology Inc. announced a family of small form-factor Very Low Profile VLP DDR3 Registered ECC SO-DIMM, VLP DDR3 ECC SO-DIMM, VLP DDR3 SO-RDIMM and VLP DDR3 SO-CDIMM ECC memory for embedded systems.
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| Ex-CEO of Infineon to head Grace Semi |
9/21/2007 |
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Ulrich Schumacher, former CEO of Infineon Technologies AG who left the company about three years ago, has taken on the positions of president and CEO at foundry Grace Semiconductor Manufacturing Corp.
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| Acer sees more consolidation in PC market |
9/21/2007 |
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The personal computer industry is in for a wave of consolidation and there will only be room in the market for a few major players, Acer President Gianfranco Lanci said.
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| Sharp buys 30 million shares of Pioneer |
9/21/2007 |
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Sharp Corp. will buy about $357 million worth of new shares from Pioneer Corp. to form alliances and respond to increasing shareholder pressure for better returns.
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| DRAM, NAND flash prices under pressure |
9/20/2007 |
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A-Data Technology said that both DRAM and NAND flash pricing will turn to worse in the next few months, according to a source familiar with the company.
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| Sprint to roll out WiMax coverage in 30 US cities |
9/20/2007 |
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Sprint Nextel said it expects to have WiMax available in "30ish" U.S. markets covering a population of 100 million people about the same time Intel releases its next-generation mobile chipset that will embed the wireless technology in notebooks.
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| Spansion starts MirrorBit chip using 65nm process |
9/20/2007 |
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Spansion announced today it has started production of MirrorBit technology at 65-nm process technology on 300-mm wafers at its Spansion 1 (SP1) facility in Aizu-Wakamatsu, Japan and plans reach high volume production by the end of the year.
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| Intel to deliver Wimax chip by 2008 |
9/19/2007 |
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Intel said it is keeping its promise to deliver WiMax-Wi-Fi chip in mid-2008 that would support 25-watt Intel Penryn mobile processors.
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| USB 3.0 to deliver 4Gbits/s |
9/19/2007 |
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Intel Corp. announced it is working with a handful of companies on a specification that could push the USB's theoretical throughput beyond 4 Gbits/second, ten times its current rate.
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| Microsoft antitrust appeal rejected by European court |
9/17/2007 |
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Microsoft suffered a major setback in Europe as the Luxembourg-based European Court of First Instance rejected almost all the substantive arguments in its its appeal to annul the antitrust decision made in 2004 by the European Commission.
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