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India surpassed U.S. as Nokia No.2 market 8/23/2007
Nokia said yesterday that India surpassed U.S. in the second quarter as its second largest market after China.
iRobot upgraded the Roomba 8/23/2007
iRobot introduced the Roomba which is able to clean floors on its own.
Agilent shows its simulation tool 8/23/2007
Agilent Technologies Inc. debuted its 3D simulation technology which is specially designed to expand the accuracy of passive circuit libraries used in RF and microwave designs.
Intel develops 65-nm embedded NOR 8/23/2007
Intel Corp. announced that ,in 2008, it going to make 65-nm embedded NOR flash memory ICs.
Toshiba to offer biggest laptop disk drive 8/23/2007
Toshiba Corp. is launching the largest avilable capacity 2.5-inch disk drive-- a 320-Gbyte 2.5-inch hard disk drive.
Mobile Chip Market to Shrink 8/22/2007
The cell phone microchip market is likely to shrink for some get squeezed by big leagues.
AMD unveils new channel programs 8/22/2007
AMD took its two new channel programs out to attract eyes on Monday.
Infineon eyes only on market share 8/22/2007
Infineon buys market share through the way of buying LSI's mobile chipset business.
Analog Devices reports 17% quarterly decline 8/22/2007
because of the increasing costs and expenses, Analog Devices Inc., a maker of signal processors, reported a 17 percent decline in quarterly profit Tuesday.
Entegris acquired coatings firm 8/21/2007
The high-purity semiconductor coatings business of Surmet Corp has been acquired by Entegris Inc.-the material handing specialist.
Tower cuts supply chain costs 8/21/2007
Tower said a joint partnership of Exel MPL and AVBA Hi-Tech Services is to adopt to cut supply chain costs.
IBM co-works with TDK for MRAM research 8/21/2007
IBM and TDK yesterday announced a joint program to do high-density magnetic random access memories (MRAMs) research.
LSI sells mobility line to Infineon 8/21/2007
LSI Corp. sold its mobility line to Infineon Technologies AG recently.
Taiwan semi fabs output value to increase 8/20/2007
Because of the increasing demand, the output value of Taiwan's contract chip makers is expected to reach US$3.66 billion in the third quarter, over the previous quarter by 16.9% .
Zarlink unloaded shares in Mitel 8/20/2007
After Mitel has been approved to merge with Inter-Tel Inc,Zarlink Semiconductor Inc. has unloaded its shares in Mitel Networks Corp.
Semefab bought building for MEMS 8/20/2007
Semefab has bought the building next to its Fab 1 & 2 facilities in Glenrothes in order to create an 871 sqm cleanroom for MEMS front end processing.
Samsung to meet only 85% of NAND order 8/20/2007
Samsung Electronics is only going to meet 85% of its promised amount of NAND flash supply to its major customers.
HP posted great profit and revenue 8/17/2007
Described by chairman and CEO Mark Hurd as the company's "best revenue growth since 2000." the Palo Alto, Calif., company said net income rose 29 percent and revenue strengthened 16 percent in its fiscal third quarter ended July 31, on a surge in software revenue, and healthy demand for computers, especially notebooks.
Does VOIP has the reliability we needed? 8/17/2007
In general, VoIP is considered to be more unreliable than the Public Switched Telephone Network since it relies on data connections to transmit voice. Subscribers take a chance when they sign up for VoIP services, but it's up to the providers to address issues as quickly as possible or ideally to eliminate them altogether.
China, not the ideal environment for every manufacturer 8/17/2007
Universal Instruments' foray into China hasn’t been a total disappointment, however. It has had success in managing an R&D innovation center in Suzhou, Jiangsu province, which provides technical supports to its customers. Sales offices in Beijing and Shanghai also worked well to provide pre-sales and post-sales technical services.
Top EDA vendors to standardize Verilog Open Verification Methodology 8/17/2007
"We think OVM will be a great step toward speeding up the adoption of SystemVerilog and advanced verification methodologies," Glaser said. "We think it will be very well received by the user community and move to 100% adoption very quickly."
Xbox 360 to use TSMC embedded DRAM process 8/16/2007
Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) today announced that Microsoft Corp. has started production of its Xbox 360 graphics-memory subsystem using TSMC's 90-nm embedded DRAM (eDRAM) process.
Fab utilization up high 8/16/2007
The utilisation rate was 89.7 percent in the quarter, up from 87.5 percent in January-March, the Semiconductor International Capacity Statistics (SICAS) group said on Thursday.
AMD yet to confirm NY fab 8/16/2007
AMD "has until July 2009 to decide whether to proceed with the project. After that, $1.2 billion in state incentives will expire,".
Sony selects Singapore for new battery plant 8/16/2007
Sony said in a statement that the facility, which is due to begin operations in August 2008, will employ about 500 people and produce up to 8 million lithium-ion polymer batteries a month.
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