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Japanese are going joint Mega Fab concept 11/18/2005
Five Japanese semiconductor manufacturers have reportedly reached a basic agreement to establish a joint fab at a cost of about ¥200 billion ($1.67 trillion).
Consumer IC to take center stage 11/17/2005
Worldwide sales of microchips are expected to reach $309 billion in 2008, an increase of 45 percent from $213 billion in 2004.
President Bush leads to eleminate MCP tarriff 11/17/2005
Earlier this month, representatives from the U.S., Korea, Japan, Chinese Taipei and the E.U. finalized the draft agreement on duty-free treatment of multi-chip package ICs during a Governments/Authorities Meeting on Semiconductors in Seoul, Korea.
Micron Nand Flash taking hold on market 11/17/2005
Micron increased its NAND revenue by 400 percent, causing its ranking to rise to fifth place, up from seventh in the second quarter. Micron climbed at the expense of STMicroelectronics which slipped from fifth to seventh place.
Analyst predicts continue DRAM price errosion 11/17/2005
In 2007 the market will go through a major pricing correction and decline by 20 percent to $19.5 billion with component pricing dropping by 50 percent, Gartner asserted. This will come after a year of weak DRAM market conditions in 2006 during which revenues are set to decline 5.0 percent to $24.4 billion and pricing to decline 37.1 percent.
Infineon to focus smart card business on German national system 11/17/2005
Infineon is pinning its hopes on the personal identification market. The German government is scheduled to introduce electronic passport systems soon. Last June, Infineon was awarded a government contract to supply half of Germany's ePass chips and antennas.
Nanoelectronics market expected to grow 11/16/2005
The markets for nanomaterials, tools and equipment for nanoelectronics totaled $1.8 billion in 2005 and are forecast to reach $4.2 billion by the year 2010, according to Semiconductor Equipment and Materials International (SEMI).
ProMos move ahead on second 300-mm fab 11/16/2005
ProMOS, a supplier of DRAMs, held the ceremony for its 300-mm Fab 3 plant in the Central Science Park in Taichung. The company’s first 300-mm fab is located in Hsinchu. “The newly inaugurated 300-mm fab is Taiwan’s first 300-mm DRAM fab to deploy 90-nanometer technology in mass production of 512-Mbits DDR1 and DDR2,”
AMD puts quad-core on roadmap 11/16/2005
AMD had said previously it expected to release a quad-core part by 2008. Intel, on the other hand, recently released a roadmap that called for quad-core in 2007.
Latest DRAM producer statistic 11/16/2005
The top eight ranked vendors of DRAM retained the same positions in the third quarter, according to market research company iSuppli Corp., although market leader Samsung Electronics Co. Ltd. displayed relatively low sequential growth of 5.8 percent.
Intel see untapped opportunities in Middle East 11/16/2005
Intel will focus on investments in innovative companies that complement Intel's technology and platform initiatives in areas such as wireless broadband (especially WiMax), and in local content developers/providers, digital health solutions, IT service providers and software solutions.
M-Systems to get Mobile business though $40M acquisition 11/15/2005
M-Systems Flash Disk Pioneers Ltd. said today it would acquire Microelectronica Espanola, a Madrid, Spain-based smart card and smart card operating systems company for $40 million in cash. “We now expect to offer a unique portfolio of storage solutions for mobile handsets - DiskOnChip Embedded Flash Drives, memory cards, MegaSIM products and SIM cards,”
Infineon departs its fiber optics business 11/15/2005
Automotive supplier Siemens VDO has agreed to take over the Trutnov plant beginning July 1, 2006. Until then, the companies will work in parallel at the site to allow Siemens VDO to ramp production of electric motor drives while Infineon fulfilling remaining customers requirements.
Huawei selects Agere network processor 11/15/2005
The two companies announced at this week’s 3G World Congress in Hong Kong that the processors will be used in switching systems that integrate Asynchronous Transfer Mode and Internet Protocol traffic.
Cray goes with AMD processor on next Super computer 11/15/2005
“After an extensive review of marketplace alternatives, we selected the AMD64 platform as the microarchitecture for our next-generation supercomputer products," said Cray President and CEO Peter Ungaro, in a statement. "In the near-term, the AMD Opteron processor roadmap provides our customers a smooth upgrade path to multi-core systems.”
Infineon to look into IPO option for Infineon 11/15/2005
One possibility is that Infineon (Munich, Germany) would sell off its share in the Inotera Memories Inc. joint venture to Nanya, sell of its U.S. operations to Micron and try to gain value for its European DRAM business, in the absence of any obvious buyer, through an IPO.
Elpida starts sampling of DDR3 modules 11/14/2005
Elpida Memory Inc., Japan's only dedicated DRAM manufacturer, has started sampling 512-Mbit DDR3 SDRAM chips and dual in-line memory modules (DIMMs) built with the DDR3 chips
Sun launches Niagara four-core processor 11/14/2005
HP, IBM, and Sun Microsystems take a two-pronged approach to the server market: Low-end x86-based systems and high-end machines based on powerful processors
Kingmax introduces Super Stick flash drive 11/14/2005
Kingmax recently introduced its new Super Stick family of USB flash drives measuring 39×12×2mm in size and weighing less than five grams
Intel to debut Broadwater 965 chipsets in 2Q 2006 11/14/2005
Intel plans to introduce its 965-series chipset, codenamed Broadwater, in the second quarter of 2006.
AMD says open platform spec gaining traction 11/11/2005
AMD said its Open Platform Management Architecture (OPMA) specification has gained acceptance among infrastructure vendors, systems builders, and solutions providers.
Intel and Kingston gain board seats in NAND flash association 11/11/2005
The MultiMediaCard Association (MMCA) gained two new heavyweights to its board, as Intel and Kingston Technology were awarded seats.
Samsung mass produce 512Mbit Mobile DRAM 11/11/2005
Samsung announced its has started mass producing 90nm-made 512Mbit mobile DRAM.
Atmel rolls out wireless foundry process 11/10/2005
Atmel rolled out a new, 0.18-micron process technology for wireless customers.
IDT posts loss amid restructuring 11/10/2005
IDT said revenues for the second fiscal quarter were $105.7 million
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