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International consortium offers embedded memory optimizer 4/30/2003
ATOMIUM, is a comprehensive set of interactive tools that traverses application code, optimizing it to reduce the number and cost of memory transactions. The process can result in dramatic reductions in system energy consumption as well as die area.
TSMC see profit up 4/30/2003
"Our customers are loading inventories. Short-term indicators from them are pointing to very encouraging directions," the TSMC chairman said.
Connector shipment index down 4/30/2003
Connector and printed-circuit board suppliers are still struggling with weak demand and excess production capacity.
Intel drops Celeron prices 4/29/2003
The 2.4GHz Celeron was dropped 19% to $103, while the 2.3GHz chip fell 24% to $89.
Taiwan president urge transformation into R&D center 4/29/2003
Taiwan is bound to reinvent itself from a production base to an operations, research and development hub in the Asia-Pacific region.
ChipPac reports year to year increase sales 4/29/2003
Fremont, Calif.-based assembly and test house ChipPAC Inc. today reported Q1 revenue declined 4.4 percent sequentially to $88.6 million, per the company's previous guidance, but still up 11.9 percent year over year
Infineon to cut jobs 4/29/2003
Infineon will cut 500 jobs from its corporate layers, such as administration, and another 150 jobs from its Secure Mobile Solutions Group. Transferring and outsourcing will trim another 250 jobs worldwide and lead to other savings.
Industry have not seen disruption of SARS yet 4/29/2003
Market researchers research Gartner surveyed 20 major semiconductor companies in Hong Kong and China and found that most vendors had so far seen no significant negative effects from SARS.
TSMC included 65nm in their roadmap 4/28/2003
The TSMC released 2004 roadmap for higher advanced process technology during their TSMC 2003 Technology Symposium. TSMC presented the first details of its 65-nm technology for use in next-generation designs starting in late 2004 according to Jack Sun, TSMC's senior director of logic technology.
Hynix fights EU decision 4/28/2003
The South Korean memory supplier claims that Infineon Technology AG and Micron Technology Inc., the two companies that separately spurred anti-subsidy investigations against it, have caused more harm than good.
TI jumps on market with power over Ethernet chip 4/28/2003
Power over Ethernet is an emerging standard that allows both direct current (DC) power and data to be delivered over a standard Ethernet cable. This would free various devices that use Ethernet connectivity from requiring a separate power supply.
Semi equipment outlook positive 4/28/2003
Sales of semiconductor manufacturing equipment will rise slowly until the fourth quarter and then accelerate as more companies start to outfit 300mm wafer fabs and transition to 90-nanometer process technology.
Intel follows AMD footstep to provide 64/32bit scalable processor 4/28/2003
Not to be upstaged by archrival Advanced Micro Devices Inc.'s new Opteron microprocessor, Intel Corp. later this year will upgrade its 64-bit Itanium 2 MPU to run 32-bit x86 programs at about 1.5GHz.
Mosaid gets royalty on their DRAM technology 4/28/2003
"This agreement is an important achievement for Mosaid since Winbond Electronics is our first running royalty term licensee, as well as the first Taiwanese company to license our patents,"
UMC strengthening design capability 4/25/2003
This means the company may no longer be able to accept certain new IC designers that may be competing with its existing clients. It is part of UMC's strategy to invest in IC design houses in Taiwan and overseas to secure orders.
IDC projects Hyper Transport to take hold 4/25/2003
Vernon Turner, IDC group vice president, said the 2003 projections are based on actual parts counts ot items shipped and silicon starts and products already committed to production by the end of 2002.
Samsung to upgrade Austin plant to 90nm 4/25/2003
First opened in 1998, the Samsung Austin DRAM fab will be updated from 130-nm technology to 90-nm design rules, with a 40,000 sq. ft. addition to the existing clean room. The facility upgrade will start next month.
Combining ASIC with FPGA on a die 4/25/2003
The technology would let Samsung's ASIC customers design a single device that could be used across multiple product lines. Samsung may also design its own standard products in this way, officials said.
ST profit improved 4/25/2003
The Geneva-based company said it earned $79 million, or 9 cents per share, in the quarter ended March 29, up 140% from $33 million, or 4 cents a share in the first quarter of 2002.
NEC statement improves, but still a loss 4/25/2003
NEC attributed the loss to its semiconductor affiliate and to a write down of deferred income tax due to a new corporate activity tax.
United Arab Emirates to build new silicon park 4/24/2003
The park is scheduled for construction next year, and will be located in Nad Al Shiba on 6.5-million square meters. It is intended to complement -- rather than compete with -- Dubai Internet City, a functioning IT and telecommunications center inside the free trade zone.
Analyst said equipment recovery is real 4/24/2003
Robert N. Castellano, president of TIN, said that based on good Q1 results, the semiconductor equipment market has begun its much anticipated recovery.
STMicro and Hynix to team up in NAND flash market 4/24/2003
Under the terms of the agreement, STMicro of Geneva and Hynix of Seoul will jointly develop and introduce a full NAND product portfolio, beginning with a 512-megabit device to be introduced in the second half of 2003. The products will be marketed by both companies.
Tower to start shipping from new 8" fab 4/24/2003
Tower will make 4-megabit asynchronous SRAMs in the plant, based on its 0.18-micron process technology. Tower expects to begin commercial shipments of the product in mid-2003.
US to Taiwan electronic business lost volume due to war 4/24/2003
Taiwan's export orders from the United States declined in March as a result of the war with Iraq, although the orders are expected to pick up again in the war's aftermath.
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