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Samsung 1st quarter chips revenue increase 4/4/2003
Samsung Electronics Co. Ltd.''s Q1 semiconductor sales were slightly higher than the year-ago results of $2.36 billion (2.97 trillion won), according to Reuters.
HP to include DVD-burning in PCs 4/4/2003
Hewlett-Packard is planning to equip DVD-recording drives in the consumer PCs. Back in 1999, HP had the success by first introduced the CD-RW ahead of competitors, quickly making the technology standard equipment on all consumer PCs. On Thursday, HP launched its first DVD-burning notebook, the Pavilion ze5300, and a low-cost DVD-recording desktop.
McDonald's put WiFi to test 4/4/2003
Ten McDonald's restaurants in Manhattan are offering customers WiFi internet connection in a three-month experiment. If the plan works, hundreds more restaurants will be upgraded with the wireless connection by the end of the year, according to the company.
Dell now sells projectors 4/3/2003
Multimedia projectors are expected to become the next big thing, as Dell Computer along with many competitors recognizes the opportunity. Dell is now selling the new 2100MP multimedia projector at $1,299.
SiS May Spin Off Graphic Chip Division 4/3/2003
Silicon Integrated Systems (SiS) is considering spinning off its graphics chip unit, according to a source familiar with the company.
Hynix to sell DRAMs through Taiwanese motherboard makers 4/3/2003
To get around the heavy import duties, Hynix is reportedly seeking alliance with Taiwanese motherboard makers to bundle DRAM with motherboards for sale directly from Taiwan to the US and Europe.
Dell backs sales outlook 4/3/2003
Dell Computer Corp. backed its outlook for an 18 percent jump in first-quarter revenue, citing demand for its computer products has remained strong.
Lexmark to introduce new products 4/3/2003
Lexmark International plans a major product unveiling next week targeting corporate market that want all printing, scanning and coping functions to be integrated in one machine, reported by news.com
UMC to produce more wafers in 300mm 4/2/2003
United Microelectronics Corp. is reportedly running its 8-inch 0.13-micron lines at full capacity, prompting it to activate lines at its 300mm plant in Tainan, Taiwan, according to a report.
NEC to sell its fab in Europe 4/2/2003
NEC is looking to sell its 200mm wafer fab located in Livingston, Scotland. NEC is currently talking to potential buyers at the SEMICON Europa conference in Munich, Germany, this week.
Hynix to pay import tax 4/2/2003
In the premilinary hearings, the Commerce Department imposed a 57% import tariff on chips from Hynix Semiconductor Inc. due to unfairly subsidized by its government.
A better year for Flash and DRAM market 4/2/2003
iSuppli said global memory sales would see a 15% increase in 2003 compared to 6.2% growth in 2002.
The growth in 2002 was mainly in the DRAM sector, which increased by 32.2% in 2002.
Nokia to manufacture cell phones in China 4/1/2003
Nokia said Monday it will start making its own brand-name phones in China and strengthen its presence in the world's most populated country.
Dell to sell its line of printers 4/1/2003
Dell plans to unveil its new line of printers, manufactured by Lexmark International Inc. Dell hopes to drive down prices in the printer market, just as it did with personal computers.
Nortel to return to Wi-Fi market 4/1/2003
Nortel existed the wireless market in 2001. On Monday, it decided to return to the high-end wireless networking equipment market mainly for the telephone carriers and midsize to large businesses.
NEC to stop PDA sales in Japan 4/1/2003
NEC has decided to temporarily exit the PDA market in Japan due to weak sales and increase competition, sources from Japan said.
Gateway delays annual report release 4/1/2003
Gateway said it will seek an 15-day extension from the Securities and Exchange Commission for filing its 2002 annual report. Gateway said that it needed more time to review its accounting because of an SEC investigation of its 2000 financials and changes in software-bundling fees received from America Online.
Samsung unveiled four-chip package for handsets 3/31/2003
Samsung Electronics announced full production of its four-chip stacked package (MCP) for mobile handsets.
Broadcom wins HP WiFi deal 3/31/2003
Broadcom Corp. announced that it has won a deal from HP/Compaq to sell its 54g 802.11g wireless LAN chipset as an upgrade option for the Presario 2100 and 2500 model notebook PCs.
AMD and Fujitsu on new venture plan 3/31/2003
AMD is expected to announce a new company with Fujitsu to better coordicate in operations, sales and marketing under one combined sales force.
Hynix may face stiff import duties 3/31/2003
The U.S. Department of Commerce may impose the punitive import duties on Hynix Semiconductor, a possible ruling over the allegations by Micron Technology that it was materially injured by imports from South Korean chipmakers that received illegal state aid.
Semiconductor sales down in February 3/31/2003
Global chip sales dip a 3.3 percent in February from January's $12.2 billion in revenue, but better than the $10 billion last year, according to a research firm.
GSMC set to fab first China 12-inch wafer 3/28/2003
GSMC will start testing 12-inch wafers in April, making them the first foundry in China to produce wafer using 12-inch foundry
Taiwan is No-4 recipient of U.S Patent 3/28/2003
Taiwan's economics ministry said on Friday the island was the fourth-largest recipient of U.S. patents in 2002, trailing the United States, Germany and Japan
Chinese foundries rushing to acquire IC design tools 3/28/2003
Chinese organizations are rushing to collaborate with electronic design automation (EDA) vendors of the United States
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