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| China solicits anti-SARS technology |
5/2/2003 |
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China is working directly with the “National SARS Task Force of China” to locate technologies and products that could be used to treat, prevent or control the spread of SARS.
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| Celestica closing Dublin manufacturing |
5/2/2003 |
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The company blamed the continued downturn in the telecoms sector as the reason for the plant's closure, which made PCBs for mobile phones and networking devices. The company said it plans to move production to other facilities overseas.
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| SARS effect being felt in business |
5/1/2003 |
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37 percent of those polled, said that they have suspended new investments or expansions in their manufacturing and marketing operations on China. Ironically, most of the companies took the survey said SARS have not affected their major operations.
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| Applied Materials get new CEO from Intel |
5/1/2003 |
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The executive reorganization caught analysts by surprise, even though the company has undergone a period of restructuring, including layoffs, as it suffers from uninspiring financial results in the downturn.
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| Rambus case starts at FTC anti-trust hearing |
5/1/2003 |
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At the opening day of an FTC antitrust hearing here, the two sides squared off over whether Rambus was required to disclose pending synchronous memory interface patent applications to the JEDEC industry panel when Rambus sat on a JEDEC subcommittee to define an open SDRAM standard.
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| UMC business down but expect recovery in 2Q |
5/1/2003 |
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"We are expecting second quarter wafer shipments to increase by more than 20%. Demand for PCs would represent the biggest portion of the growth, followed by consumer and communications products.
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| TI chips to be used in China base stations |
5/1/2003 |
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TD-SCDMA is being developed as a third generation (3G) mobile communications standard for deployment in China. The Siemens 3G-based basestations are already in field trials in China and deployments with Chinese operators are expected to start at the end of 2003, TI said.
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| Asia's largest PC events, postponed |
5/1/2003 |
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Taipei Computer Association (TCA) and the China External Trade Development Council (CETRA), made the decision to postpone Computex and have not announced a new date for the event.
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| Computex postponed due to SARS |
4/30/2003 |
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The organizers have decided to postpone COMPUTEX TAIPEI 2003 to the last half of 2003. The exact days of the new schedule will be announced by the end of May.
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| Tokyo Electronic cut 1000 jobs |
4/30/2003 |
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TEL expects the semiconductor and semiconductor manufacturing equipment industries to continue to grow over the mid- to long-term, while seeing normal silicon cycle fluctuations. However, the company said there is a "global shakeout among the contenders."
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| Infineon transitions into 0.11 micron DRAM |
4/30/2003 |
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The resultant smaller chips lead to a production cost advantage per chip of around 30 percent compared to Infineon's current volume process technology, according to the company.
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| EX-Intel employee charged with Al Qaeda link |
4/30/2003 |
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Federal prosecutors on Monday (April 28) charged a former Intel Corp. engineer with allegedly conspiring to aid Al Qaeda and the Taliban, as part of a move to “levy war” against the United States
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| Court to start again on Rambus vs Memory Industry |
4/30/2003 |
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FTC lawyers will argue that Rambus (Los Altos, Calif.) violated U.S. antitrust laws “by deliberately engaging in a pattern of anticompetitive acts and practices that served to deceive an industry-wide standard-setting organization,” the Joint Electron Device Engineering Council (Jedec).
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| International consortium offers embedded memory optimizer |
4/30/2003 |
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ATOMIUM, is a comprehensive set of interactive tools that traverses application code, optimizing it to reduce the number and cost of memory transactions. The process can result in dramatic reductions in system energy consumption as well as die area.
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| TSMC see profit up |
4/30/2003 |
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"Our customers are loading inventories. Short-term indicators from them are pointing to very encouraging directions," the TSMC chairman said.
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| Connector shipment index down |
4/30/2003 |
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Connector and printed-circuit board suppliers are still struggling with weak demand and excess production capacity.
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| ChipPac reports year to year increase sales |
4/29/2003 |
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Fremont, Calif.-based assembly and test house ChipPAC Inc. today reported Q1 revenue declined 4.4 percent sequentially to $88.6 million, per the company's previous guidance, but still up 11.9 percent year over year
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| Infineon to cut jobs |
4/29/2003 |
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Infineon will cut 500 jobs from its corporate layers, such as administration, and another 150 jobs from its Secure Mobile Solutions Group. Transferring and outsourcing will trim another 250 jobs worldwide and lead to other savings.
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| Industry have not seen disruption of SARS yet |
4/29/2003 |
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Market researchers research Gartner surveyed 20 major semiconductor companies in Hong Kong and China and found that most vendors had so far seen no significant negative effects from SARS.
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| TSMC included 65nm in their roadmap |
4/28/2003 |
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The TSMC released 2004 roadmap for higher advanced process technology during their TSMC 2003 Technology Symposium. TSMC presented the first details of its 65-nm technology for use in next-generation designs starting in late 2004 according to Jack Sun, TSMC's senior director of logic technology.
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| Hynix fights EU decision |
4/28/2003 |
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The South Korean memory supplier claims that Infineon Technology AG and Micron Technology Inc., the two companies that separately spurred anti-subsidy investigations against it, have caused more harm than good.
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| TI jumps on market with power over Ethernet chip |
4/28/2003 |
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Power over Ethernet is an emerging standard that allows both direct current (DC) power and data to be delivered over a standard Ethernet cable. This would free various devices that use Ethernet connectivity from requiring a separate power supply.
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| Semi equipment outlook positive |
4/28/2003 |
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Sales of semiconductor manufacturing equipment will rise slowly until the fourth quarter and then accelerate as more companies start to outfit 300mm wafer fabs and transition to 90-nanometer process technology.
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