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Agilent layoffs 4,000 workers 2/21/2003
Agilent Technologies reported a widened first-quarter loss amid the slowdown in tech spending. To cut cost and return to profitability, it plans to cut 4,000 of its 35,000 employees in the coming months.
Samsung, Infineon, Hynix DDR400 announced validated DDR400 2/20/2003
Samsung Electronics, Hynix Semiconductor and Infineon Technologies announced that their 256Mbit DDR400 have passed Intel’s validation test on the new Springdale chipsets.
Matsushita posts 3Q profits 2/20/2003
Matsushita Electric posted a third quarter profit of 20.9 billion yen ($176 million) compared to a loss a year ago citing strong sales of DVD recorders and plasma display TV sets.
Intel to embrace DDR400 2/20/2003
Intel's move to release the 800MHz front side bus chip will lift the demand for DDR400 even for a short cycle.
Infineon, Saifun Semi joint-venture to make flash memory 2/20/2003
Infineon Technologies is forming a joint venture with Saifun Semiconductor of Israel to produce flash memory chips.
National Semi cut 5% jobs 2/20/2003
National Semiconductor Corp. said it will reduce 500 jobs or 5% of its work force and take a charges of $35 million to $45 million as part of a restructuring.
Intel expects 4-7% growth in IT spendings 2/19/2003
Intel's CEO said at Intel Developer Forum that worldwide information technology market is expected to grow by 4%-7% to $3 trillion in 2003 in anticipation of the PC upgrade and broadband push.
Intel to spend $2 billion on Arizona plant upgrade 2/19/2003
Intel said that it plans to spend $2 billion to upgrade one of its manufacturing plants in Arizona with newer technologies.
Crusoe based tablet PC available in England 2/19/2003
Transmeta's Crusoe processor will be used in Viglen's new eXaro tablet PC, which is on sale now in the United Kingdom.
SGI signs $26 million deal with Army 2/19/2003
SGI has won a $26 million contract to supply the U.S. Defense Department with high-end technical computing machines, software and services over the next 42 months, the company said.
Micron to cut workforce 2/19/2003
Micron Technology announced plans to cut approximately 10 percent of its staff to battle the prolong sluggish of the technology market.
AMD, ASE joint developed Flip-Chip Packaging 2/18/2003
Advanced Micro Devices Inc. and Advanced Semiconductor Engineering Inc. (ASE) have signed a deal to jointly develop technologies for flip-chip assembly on organic packages for microprocessor chipsets, the companied announced today.
Manufacturing index in NY drops 2/18/2003
The manufacturing index in New York State fell in February to the lowest level in four months, the Federal Reserve Bank of New York said Tuesday.
Chips sales expected to rise 2/18/2003
Demand for PCs, cell phones,digital cameras and wireless systems could boost industry revenue 20% in 2003, amid the continued economic recovery and a possible war, reported by a research firm.
Cisco launches new ad 2/18/2003
Cisco is launching a $150 million global marketing campaign to raise awareness of the company and boost sales. The ad campaign will appear in print, on television and, and on the Internet.
PC shipments may rise in 2003 2/18/2003
PC shipments will post a modest increase for 2003 despite the continuous slow economy, according to a new report by Gartner Dataquest.
Sony Ericsson to release 3rd-generation phone 2/17/2003
Sony Ericsson said Monday it will launch its first third-generation phone later in 2003.
IBM PowerPC is available for license 2/17/2003
IBM said that it is making the 440GX PowerPC architecture available for licensing.
Rambus speed up its memory interconnection technology 2/17/2003
Rambus Inc. disclosed its new Redwood high-speed logic bus interface. It claims data rates of up to 6.4GHz or 10 times faster than the current highest speed 667MHz processor front side buses, the company reported.
Toshiba makes flash memory deals 2/17/2003
Toshiba reportedly said it is making deals to sell flash memory chips based on M-Systems Flash Disk Pioneers Ltd.'s flash memory capacity-doubling technology as well as to work with Infineon Technologies AG on a new flash technology.
Wafers shipment on the rise 2/17/2003
Silicon wafer shipment worldwide rose sharply in 2002, while revenue grew at a modest rate, according to a new report from a semiconductor industry group.
Legend to expand utilizing Taiwan IT technology 2/14/2003
IDC recently released the list of top-selling personal computer (PC) brands in the non-Japan Asia in the fourth quarter of last year. Legend of mainland China remained at the top of the list, followed by three U.S. brands: HP, IBM, and Dell.
Unemployed engineers protested H-1B visa 2/14/2003
A group of unemployed high-tech workers demonstrated against the U.S. government's H-1B visa program on Wednesday (Feb. 12) outside a Dallas hotel where the IEEE-USA's board was holding its quarterly meeting.
Would embedded DRAM replace SRAM cache? 2/14/2003
IBM's memory evangelists are predicting an increase in the instances where embedded DRAM replaces conventional SRAM, especially in high-performance processors such as Intel Corp.'s Itanium line.
iSuppli forcast continue glut in IC supply 2/14/2003
What is clear is that the overcapacity, low utilization rates and depressed pricing that has dogged semiconductor manufacturing for the last two years are likely to linger for some time to come.
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