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SiS to design chipset for Intel Processor 4/16/2003
SiS have received licensing from Intel to design chipsets for the Pentium-4 processors using an 800-MHz front-side bus
Elpida to expand 300mm DRAM Chips Output 4/15/2003
Elpida Memory said it may increase its manufacturing output to 15,000 300-mm diameter wafer starts per month by the end of 2003, from current levels of 3000
Intel to position Pentium-M chip for mobile application 4/15/2003
Intel will announce two Pentium M processors made for communications and networking applications.
Hynix faced 33% EU Tarriff 4/15/2003
The European Union will impose a 33-percent countervailing tariff on Hynix's memory chips starting April 25
Xillinx ship 90nm process FPGA 4/15/2003
Xilinx said that it is shipping samples of a new field programmable gate array (FPGA) using a 90nm process technology.
Taiwanese chipmakers pooling to share chipmaking resource 4/14/2003
Taiwanese chipmakers are pooling their silicon know-how in a bid to boost the country's chip competitiveness in the global market.
Intel to delay 3Ghz CPU due to last minute hiccups 4/14/2003
A possible problem with the 3GHz Pentium 4, discovered on sunday have forced the Intel to delay the chip launch
VIA launch new chip for AMD XP Platform 4/14/2003
VIA Technologies announced launch of 4th-generation integrated graphics chipset for the AMD Athlon XP Platform
Taiwan's TWTC plan expansion to host bigger shows 4/11/2003
"The emerging exhibition and conference industry is promising, giving Taiwan a greater selection of venues to offer in the future."
Video conference replacing traval? 4/11/2003
Integrated Vision, one of Australia’s largest videoconferencing providers, has reported a 44 percent increase in queries since the outbreak, from an average of 90 calls per day up to 130.
Single mixed signal IC caused $100m missle test failure 4/11/2003
The disclosure came during a missile-defense panel at the National Space Symposium here. Kelble said the single-chip failure indicates that layers of systems must operate in unison in order to achieve an effective U.S. missile defense.
Micron moves quickly out of Sync-SRAM business 4/11/2003
Cypress Semiconductor Corp. said it will buy Micron Technology Inc.'s entire inventory of communications-oriented synchronous SRAM products for an undisclosed amount.
Nokia to cut 1800 staff 4/11/2003
In what amounts to a scaling back of its infrastructure business, Nokia said it would cut some R&D jobs and reduce the number of programs and products it supports within the division.
Intel enters CSP stacking for handset market 4/11/2003
Claiming to be half the size of its previous four-die chip-stacking technology, Intel is gearing its new Ultra-Thin CSP offering for a range of products. Applications include small, feature-rich handsets that include color liquid-crystal displays and cameras.
Analyst said Intel will keep lead in value PC 4/10/2003
In-Stat/MDR further found that Intel's value-processor ASP will be relatively stable from Q2 through Q2 2004, and the notebook ASP will actually increase slightly as competition weakens and the P7 microarchitecture ratchets up clock speeds.
Military communications to go packetized 4/10/2003
The new multi-service architecture shares many traits with the public Internet. These include a shift from circuit to packet communications and severe bandwidth bottlenecks in the last mile to the user.
MS commits delivery for Windows Opteron 64 4/10/2003
Microsoft Corp. announced Wednesday (April 9) that it will deliver in the middle of this year beta versions of Windows XP and Windows Server 2003 for Advanced Micro Devices' Opteron and Athlon 64 processors.
Analyst see WiFi to grow at 43% 4/10/2003
"There is a very elastic relationship between pricing and demand in the wireless LAN market, and every step down in prices brings the industry closer to unlocking new opportunities and applications," the company said.
Taiwan foundries report revenue jump 4/10/2003
Both of the top two foundries reported sales growth for the month of March, but in April and May sales may not see any improvement as the US war with Iraq erupted last month. Both firms agreed that sales will depend on the result of war whether in ends quickly or drags on.
NEC revised for lower forcast 4/9/2003
The downturn was mainly attributed to a loss of $133 million (16 billion yen) incurred from the reexamination of deferred income tax assets resulting from the introduction of a new local tax, and increased burden of other taxes, NEC said.
Semi factory in China is perhaps good for Asia 4/9/2003
In the latest report made by Gartner, the Asia Pacific semiconductor market was worth US$57.3 billion in 2002 and it is expect to reach US$64.9 billion this year, up by 13.2 percent. The growth will continue for next four years with estimate 12 percent each year to reach almost US$104 billion by 2007.
SIS to negotiate Intel license after VIA 4/9/2003
SiS did, however, stress that it maintains a good relationship with Intel and that it respects IP rights, perhaps to buck at VIA Technologies Inc.
Semi Equipment Market continue to sink 4/9/2003
Excluding test equipment, worldwide semiconductor manufacturing equipment sales totaled $18.5 billion in 2002, a decline of 30.4 percent from 2001.
Smart to team with Mobilian on 802.11/Bluetooth combo card 4/9/2003
Mobilian Corp. provides its patented Sim-Op technologies to allow the virtually interference free coexistence of 802.11b and Bluetooth. Smart Modular Technologies Inc. provides engineering and manufacturing know-how, plus the support of its parent company, electronic manufacturing services provider Solectron Corp.
Standard group formed on computing security 4/9/2003
The Trusted Computing Group (TCG) expects to release a specification for PC security before the end of the year. A spec for cell phones, however, could be as much as two years away.
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