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Gigabyte shipped 1.55 Million Motherboards in July 8/10/2011 Gigabyte Technology shipped 1.55 million motherboards in July and up by 10% on month TSMC issues bond to raise $1.2 Billion 8/10/2011 Taiwan Semiconductor Manufacturing Company (TSMC) announced on August 9 that its board has approved the issuance of up to US$1.21 billion in unsecured straight corporate bonds in the domestic market to secure long-term, low fixed-cost funding. Global smartphone shipment up by 73% 8/9/2011 The overall global smartphone market shipped was 107.7 million units in 2Q11, an increase of 73 percent from 2010. Taiwan board makers reportedly cut July and August PCB orders by 30% 8/9/2011 Taiwan-based motherboard makers have reportedly reduced their July and August PCB orders by about 30%. UMC revenues slide 4% for July 8/9/2011 UMC report revenues of US$303 million for July 2011 SMIC hires new CEO 8/8/2011 Semiconductor Manufacturing International Corporation (SMIC) has announced the appointment of Tzu-Yin Chiu as CEO. Elpida reports loss in fiscal 1Q11 8/8/2011 Elpida Memory has reported net losses of JPY7.9 billion (US$102 million) on revenues of JPY95.7 billion for its fiscal first quarter ended ended June 30, 2011. HP cut TouchPad tablet prices 8/8/2011 HP cut prices of its 16GB and 32GB TouchPad tablets sold in the US by US$100 to US$399 and US$499, respectively. UMC predict 3Q11 revenue decline 8/5/2011 United Microelectronics (UMC) expects revenues to decrease sequentially in the third quarter of 2011, affected by fewer wafer shipments. Winbond posts 2Q11 profit growth 8/5/2011 Winbond Electronics has announced that net profits for the second quarter of 2011 climbed 129% Intel unveil Ultra-notebook reference design to manufacturers 8/5/2011 Intel release a reference BOM (bill of materials) without assembly costs for 21mm ultrabooks at US$475-650 and 18mm models at US$493-710. Foxconn to ship 17 million LCD TVs in 2011 8/4/2011 Foxconn Electronics is expected to ship 17 million LCD TVs in 2011 thanks to orders from Sony and a number of brand vendors in China, including Suning and Gome. AMD ships 1.5 Million LIano processor in July 8/4/2011 AMD Llano processor shipments reach 1.3-1.5 million units in July Asus to reduce Eee PC orders 8/4/2011 Asustek Computer, seeing better-than-expected Eee Pad Transformer tablet PC sales and dropping Eee PC demand, is gradually reducing its Eee PC orders. Foxconn cooperates with Synnex for China motherboard market 8/3/2011 Foxconn Electronics said it will form a strategic alliance with channel retailer Synnex Technology International to focus on China's motherboard market. Nanya report revenue down in July 8/3/2011 Nanya Technology and Inotera Memories have both reported decreases in July 2011 revenues from the previous month. Pegatron to ship iPhone 5 in September 8/3/2011 Pegatron Technology has landed orders for 10 million units of iPhone 5 to become the second ODM of the smartphone. Worldwide Semiconductor sales slip in June 8/2/2011 Worldwide sales of semiconductors for June 2011 were US$24.7 billion, down 1.5% on month and 0.5% on year, according to SIA. AData's president departs company 8/2/2011 Adata Technology announced that Il Ung Kim has resigned as company president. Elpida sample 25nm 2Gb DDR3 chip 8/2/2011 Elpida Memory has announced that it began sample shipments of 2Gb DDR3 DRAM chips built using 25nm process technology at the end of July. SIS to phase out chipset business 8/2/2011 Silicon Integrated System (SiS) is set to phase out its PC business by the end of 2011 and will turn its business focus fully to chipsets for consumer electronics in the future Samsung 2Q11 profits slips on weak demand for memory chips 8/1/2011 Samsung has announced revenues of US$37.45 billion) for the second quarter of 2011. Elpida cut DRAM production by 20% 8/1/2011 Elpida Memory said they will scale back its production output by 20% to allow prices to bounce back. AMD to unveil high-end FX series processors in September 8/1/2011 AMD is set to mass produce its high-end FX series Bulldozer-based processors in August and will launch the products in September. Toshiba has new faster eMMC Flash 7/29/2011 The new range of eMMC chips also support the latest eMMC standard from JEDEC which is version 4.41 which support multiple storage partitions making eMMC a more attractive solution for mobile devices where some data needs to be secure.  511  |  512  |  513  |  514  |  515  |  516  |  517  |  518  |  519  |  520

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