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| Foxconn keep growing |
7/28/2010 |
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Foxconn's revenue was significantly higher than No. 2 player Flextronics International Ltd, which posted revenue of $5.9 billion in Q1. Foxconn's revenue in the quarter was up 54.1% from $11.1 billion during Q1 2009.
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| Infineon recovered |
7/28/2010 |
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The net profit was up from 79 million euro (about $100 million) in the second quarter and a loss of 23 million euro (about $30 million) in the same quarter a year before. The revenue was up 59 percent year-on-year and 17 percent sequentially and the results prompted Infineon to raise its guidance for the fourth fiscal quarter and its financial year.
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| Micron pushes forward on PCM memory |
7/28/2010 |
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PCM is suitable as a storage-class memory and predicted it would be used in solid-state disk drives to drive higher performance than NAND flash memory at power consumption figures lower than RAM. Thereafter, and as systems software evolves, PCM will be able to move from an I/O drive based usage model to memory-mapped "main memory"
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| Where is DRAM prices going? |
7/27/2010 |
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According to market research firm DRAMeXCHANGE, the average sales price of the DDR3 1Gb eTT chip stands at US$2.31, down 25.24 percent from the US$3.09 in March. Since July, the average sales price of the chip has fallen 6.1 percent.
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| India to expand in chip design |
7/27/2010 |
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" Indian designers "have a strong customer base across market segments, good domain knowledge, enough skilled engineers and they can, with the help of the growing domestic electronics market, align their design expertise with the experience of multinational clients,"
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| Nvidia lost ITC case to Rambus |
7/27/2010 |
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The ITC issued a cease-and-desist order to bar the importation and sale of certain chips made by Nvidia after finding that the devices violate patents three held by Rambus. The cease-and-desist order is subject to review by the White House.
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| Producers are optimistic on DRAM prices |
7/26/2010 |
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Powerchip Chairman Frank Huang said price wars in the global DRAM industry have become a thing of the past, contending that producers are able to generate reasonable profits in today's competitive environment.
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| DRAM backend manufacturers on expansion |
7/26/2010 |
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Payton plans to expand its present monthly capacity of 45 million for DRAM memory to 65 million units at the end of 2010. The company has said previously that they have been seeing clear order visibility through the fourth quarter. Revenues are expected to grow by 20 per cent or more this year, and ramping up of capacity is happening fast enough to match demand.
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| FTC extends Intel deadline anticipating settlement |
7/26/2010 |
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The FTC on June 21 suspended administrative trial proceedings while the parties considered potential settlement of a case regarding claims of anticompetitive business practices and graphics chips originally filed by the FTC in December 2009.
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| HTC choose SLCD over AMOLED |
7/26/2010 |
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"The SLCD display offers an exceptional natural balanced color, clear contrast, broad viewing angles and improved power efficiency."
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| Semiconductor equipment order rebounced |
7/23/2010 |
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The SEMI data follows a mid-July report from VLSI Research estimating that semiconductor equipment sales will show near 96% growth in 2010. VLSI also reported that the semiconductor equipment market grew 43% sequentially and 188% year over year in Q1 to $10.4 billion.
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| Apple to become biggest semiconductor user |
7/23/2010 |
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The market research company noted that the "phenomenal" success of the iPad and iPhone is expected to make Apple the world's second-largest OEM semiconductor buyer in 2011, potentially positioning the company to become the world's top chip purchaser in 2012.
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| MS Mobile 7 OS momentum picks up |
7/23/2010 |
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Dell, Asus, LG, HTC, and Samsung are planning on releasing devices using Microsoft's mobile OS, a Microsoft executive told U.K.-based Pocket Lint. The software is expected for release around the end of year.
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| India to bring $35 tablet computer to market |
7/23/2010 |
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The tablet can be used for functions like word processing, web browsing and video-conferencing. It has a solar power option too — important for India's energy-starved hinterlands — though that add-on costs extra.
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| Samsung starts 30nm DRAM production |
7/22/2010 |
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Samsung announced that it had begun mass-producing the 'industry's first' 2Gb Green DDR3 based on the 30 nanometer technology. The 2Gb chips will allow server memory modules to reach 1.866 gigabits per second (Gbps) at 1.35 volts, and PC modules to attain clocks of 2.133Gbps on 1.5 volts.
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| Hynix reports record sales |
7/22/2010 |
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Quarter-over-quarter, DRAM average selling price and bit shipment climbed by 6 percent and 7 percent respectively. NAND flash average selling price declined by 6 percent while bit shipment increased by 22 percent quarter-over-quarter.
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| Applied restructured EES business to focus on LED |
7/22/2010 |
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Applied Materials Inc will restructure its EES (energy and environmental solutions) business, discontinuing sales to new customers of its turnkey SunFab lines for manufacturing thin-film solar panels.
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| T-Mobile will get iPhone soon |
7/22/2010 |
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Discussions between Apple and T-Mobile are said to be in an advanced state with a high likelihood that the deal will come together.
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| DRAM prices see some retreat |
7/21/2010 |
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The robust sales momentum in
Asian chipmakers is likely to extend at least into the current
quarter, but Europe's troubled economies could affect demand
and crimp profits from the fourth quarter.
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| Break through in plastic semiconductor |
7/21/2010 |
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Oak Ridge researchers said demonstrating epitaxial growth of Pedot will lead to improved, inexpensive organic semiconductors with much better energy efficiency and performance.
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| Analyst scale back 2011 semi forecast |
7/21/2010 |
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"The fact that 2010 is higher automatically makes the percentage increase in 2011 lower," said Penn stressing that the change was "mathematical rather than a change of the analysis."
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| ARM to go 20nm with TSMC |
7/21/2010 |
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The latest agreement provides access to physical and processor IP over a range of process nodes extending down to 20-nm, ARM said.
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| Work must be done to prepare for 3D stack |
7/20/2010 |
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The consensus seemed to be that the 3-D revolution is imminent. Panelist LC Lu of TSMC (Taiwan Semiconductor Manufacturing Co) said that his company is developing the TSV (through-silicon-via) technology that will interconnect the stacked chips in stacked die, with a focus on design, packaging, and testing—not just the fabrication process.
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| TI breaks profit record |
7/20/2010 |
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TI (Dallas) reported a second quarter net income of $769 million, or 62 cents per share, up 17 percent compared to the first quarter and up 196 percent compared with the second quarter of 2009.
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