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Irish researcher claims junctionless transistor 2/22/2010
The breakthrough is based on a control gate around a silicon wire that measures just a few dozen atoms in diameter. The gate can be used the squeeze the electron channel to nothing without the use of junctions or doping. The development, which could simplify manufacturing of transistors at around the 10-nanometer era.
Infineon ask ITC to block Elpida DRAM import 2/22/2010
Infineon Technologies North America Corp. have alleged in their complaint, filed on Feb. 19, 2010, that Elpida has engaged in unfair trade practices by making for importation into the U.S., and selling after importation, certain DRAM semiconductors and products that infringe four of Infineon's patents.
Intel to target 11nm with EUV 2/22/2010
At 11-nm, Intel reiterated its concept of a ''complementary'' or mix-and-match strategy, in which 193-nm immersion could work hand-in-hand with EUV or maskless lithography to enable advanced chip designs.
Caltech discovered low cost/high efficiency solar cell 2/22/2010
Solar cells based on the technique could potentially be very inexpensive to manufacture since only 2 percent of the materials are expensive semiconductors while the remainder is made from inexpensive plastic.
LED backlight price continues to fall 2/19/2010
LED backlight costs are falling faster than conventional LCD backlights, with LED backlight unit for 40 inch full HD LCD TVs to reach USD 100 in Q4 2010.
MIT researcher develop energy-harvesting systems 2/19/2010
Massachusetts Institute of Technology(MIT) researchers have develop an energy-harvesting systems that could replace batteries in electronic devices that need to work for long periods of time.
Toshiba unveils 2.5-inch HDD with Self-encrypting technology 2/19/2010
Toshiba have unveil an enterprise-class self-encrypting drive (SED) 2.5-inch enterprise-class HDD.
Anti-trust regulators agrees to Microsoft-Yahoo alliance 2/18/2010
U.S. and Europe anti-trust regulators have agree to allow Microsoft's search alliance with Yahoo.
AT & T to offer Android Phone 2/18/2010
AT&T set a March 7 release date for the Motorola Backflip, which will become the first Android-powered smartphone to run on AT&T's 3G network.
ITC to investigate Apple,Blackberry for Kodak patent violations 2/18/2010
The U.S. ITC it will start an investigation into Apple and Research In Motion based on a complaint filed by Kodak.
Verizon to offer Skype on 3G service 2/17/2010
Verizon Wireless and Skype announced a partnership that will deliver Skype mobile services to Verizon customers with data plans.
Infineon offers reference design for Android phones 2/17/2010
Infineon Technologies has announced the availability of the XMM6181 reference design to help engineers create entry-level Android smartphones.
Intel, Nokia launch open software platform for MeeGo 2/17/2010
Intel and Nokia are merging their Moblin and Maemo software platforms into an open software platform called MeeGo.
Microsoft launch Window Mobile 7 2/16/2010
Microsoft unveiled a new operating system for mobile phones after months of speculation.
Silicon revenues declined 41% in 2009 2/16/2010
Worldwide silicon wafer area shipments hit rock bottom in the first quarter of 2009, but a strong recovery was noted in each subsequent quarter of 2009
Intel partners with Sillicon Hive to enhance Atom processor 2/16/2010
Silicon Hive B.V has set up a collaboration agreement with Intel to use its parallel processing technology across mobile and embedded segments based on the Intel Atom Processor.
Qimonda test equipments up for Auction 2/16/2010
Qimonda automatic test equipments, assembly and packaging and test and measurement instruments will go under the hammer this week at Munich Germany.
NEC to unveil quad-core Cortex-A9 processor 2/15/2010
NEC Electronics looks set to grab a share of the lead in terms of high performance ARM processors at the Mobile World Congress in Barcelona next week with a quad-core Cortex-A9 design.
TI unveil multicore SoC architecture 2/15/2010
Texas Instruments has launched a system-on-chip architecture based on its multicore DSPs.
Acer to offer Notebook with Wimax chip 2/15/2010
Acer has introduced a 13.3-inch ultra-thin notebook with built-in WiMAX module.
Nanya has 42nm DRAM in qual. 2/12/2010
Nanya and Inotera will use 42nm process to produce 2GB double data rate 3(DDR3) DRAM chips. The cutting-edge process, he added, is an ideal solution for building lower power-consumption, higher-efficiency and larger-capacity circuits on smaller chip dies than last-generation process.
Toshiba to build $8.9billion NAND fab. 2/12/2010
When fully facilitized the wafer fab is expected to double Toshiba's NAND production capacity from about 260,000 wafers per month to 500,000 wafers per month.
Intel to push on new low power silicon technology 2/12/2010
Inclusion of III-V materials is a 2015 transistor option that could deliver either three times the performance of silicon at the same power consumption, or deliver the same performance as silicon at one-tenth the power consumption.
Motorola to split into two companies 2/12/2010
Motorola Inc. is moving forward with a plan to separate the company into two independent, publicly-held entities. One will include the company's mobile devices and home businesses. The other will include its enterprise mobility solutions and networks businesses.
DDR3 prices rose 2/11/2010
In terms of market dynamics, DDR3 is still in tight supply due to aggressive migration plans by PC-OEMs. Hence, DRAMeXchange projects that the contract price of DDR3 will continue to rise, while that of DDR2 will likely decline.
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