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| Taiwan companies see strong testing demand for DDR3 |
3/3/2010 |
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Powertech Technology (PTI), Walton Advanced Engineering (WAE) and Thailin Semiconductor are all expected to see a strong March, as the memory backend service providers have landed strong DDR3 memory testing orders for the month.
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| Nvidia introduces new Ion platform at Cebit |
3/3/2010 |
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Nvidia has introduced the next-generation Ion graphics processor, which it claims will offer 10 times the graphics performance of standard netbooks and enable up to 10 hours of battery life.
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| ChipMos buys Ex-Spansion equipments |
3/2/2010 |
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ChipMos Technologies Ltd. has purchased Siliconware Precision Industries Co. Ltd.'s DRAM test and LCD driver assembly and test operation lines for approximately NT$1.63 billion ($51.0 million).
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| Actel unveil FPGA with ARM processor |
3/2/2010 |
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Actel Corp introduced a family of flash-based field programmable gate arrays (FPGAs) that feature a complete microcontroller subsystem built around a hard ARM Cortex-M3 processor and programmable analog blocks.
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| AMD announces ATI Radeon HD 5830 graphics card |
3/1/2010 |
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AMD has introduced the ATI Radeon HD 5830 graphics card, bringing gamers the latest features from AMD and performance of the ATI Radeon HD 5800-series at a lower price than US$250.
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| Intel put TSMC Atom production on hold |
2/26/2010 |
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The delay in moving Atom products into production at TSMC appears signal slower-than-expected progress on execution of Intel's strategy to grow revenue outside of the PC market by pushing its x86 architecture deeper into to the embedded market and elsewhere.
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| Dramexchange reported price flat in Feb. |
2/26/2010 |
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DRAMeXchange's estimates saying March contract prices for 1Gb DDR3 may stay flat or drop slightly, and 1Gb DDR2 will likely go down. Notebook makers' shipments for the first quarter are likely to fall short of their estimates due to tight supply of some components as well as the impact of labor shortages in parts of China.
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| Hynix ownership in confusion |
2/26/2010 |
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Bank shareholders in Hynix had received no offers for their 28 percent stake in the memory maker by a recent deadline. As a result the banks, will consider other means of disposing of their stakes including selling off shares in small tranches.
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| Applied predicts DRAM capex increase by 2H |
2/25/2010 |
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The AMAT CFO says you could also that some foundries could ramp up and buy next-generation equipment. And he notes that Taiwan DRAM players also could increase their spending in the second half.
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| Elpida to take Rexchip Public |
2/25/2010 |
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Japanese chip maker Elpida Memory Inc plans to list its Taiwanese unit Rexchip Electronics on the Taiwan stock exchange in the second half of the next financial year ending March 2011,
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| Bluetooth group to address smart grid applications |
2/25/2010 |
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The study group will explore possible applications of Bluetooth in all aspects of the smart energy market. It will form a strategy for Bluetooth Smart Energy and make recommendations based on its findings.
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| Toyota still insist it is not an electronic problem |
2/24/2010 |
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In testimony on Tuesday, James Lentz, head of Toyota sales in the U.S., denied reports that electronic control units were a possible cause of runaway vehicles, which prompted the first wave of Toyota recalls.
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| TI to pickup more equipment at bargain base |
2/24/2010 |
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TI, which bought majority of Qimonda's equipment last August for $172.5 million, will be the stalking horse bidder for the remaining equipment and set the floor at a court supervised auction.
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| Samsung put 40nm DDR3 in volume production |
2/24/2010 |
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Production of the 4Gb DDR3 raises the amount of memory for use in servers to 32Gigabytes (GB) per module, which is twice the maximum density achieved with modules based on 2Gb components. With the start of volume 4-Gbit DDR3 production, Samsung plans to migrate more than 90 percent of its DDR DRAM production to 40-nm process technologies,
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| PSC to resume China fab. project |
2/23/2010 |
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PSC has already received approval from the Taiwan government to produce 8-inch wafers on 0.18-micron or or less advanced processes in China.
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| Converge predicts demand on DDR3 |
2/23/2010 |
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Industry analysts are predicting the memory market to start taking off in the second half of 2010, but Converge believes the uptick in spot market activity will begin sooner. Many of the box builders are reporting an earlier-than-expected migration to DDR3, and that will put a strain on the supply channel.
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| The Bloom Box - Super high efficiency fuel cell |
2/23/2010 |
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Within five to 10 years the company promises to reduce the price to as little as $3,000. "The Bloombox is designed to replace the grid—it's cheaper than the grid and greener than the grid,"
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