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Rambus narrows loss 11/1/2007
Rambus Inc posted a smaller quarterly loss than a year earlier as legal costs fell sharply.
IBM turns scrapped wafers into solar panels 10/31/2007
IBM says it's helping to recycle the silicon wafers into solar panels.
SMIC's loss widen 10/31/2007
SMIC has reported a net loss of US$25.6 million for the third quarter ended September 31 due to severe price declines in the DRAM market.
5.6 magnitude earthquake in Silicon Valley 10/31/2007
A 5.6 magnitude earthquake shook the Santa Clara Valley in Northern California on Tuesday (Oct. 30) evening.
$200 laptop shipped to Libya 10/31/2007
Intel and Microsoft are supplying Libya's government with 150,000 rugged laptop computers that cost $200 to build and are designed to meet the needs of children in developing countries.
Advantest introduces tester for MCPs 10/30/2007
Advantest Corp. has introduced high-speed, high-throughput memory test systems for Multi-Chip Packages (MCPs).
2-Gbit DDR3 chip by Micron 10/30/2007
Micron today announced what the company claims is the industry's first 2-Gbit double data rate (DDR) 3 component, which, the company said, is now the highest density DDR3 component available on the market.
Samsung unveils speedies DVD burner 10/30/2007
Samsung Electronics launched what the company claims is the fastest DVD burner.
Matsuhita earnings rise 10/30/2007
Matsushita Electric Industrial posted a 3 percent gain in quarterly operating profit on strong sales of digital cameras and flat TVs, but kept unchanged an annual outlook that falls short of market expectations.
SanDisk sues competitors on patent infringement 10/29/2007
SanDisk Corp. has filed three patent infringement complaints against 25 companies that manufacture, sell and import USB flash drives, CompactFlash cards, multimedia cards, MP3/media players and other removable flash storage products.
Toshiba quarterly earnings increase 10/29/2007
Toshiba posted a 38 percent rise in quarterly operating profit on Monday, thanks to sales of its flash memory chips and thermal power plants, and it raised its full-year outlook closer to market estimates.
Nokia raise market shares in handset 10/29/2007
Nokia shipped 111.7 million units or nearly four in 10 handsets shipped worldwide, a 10.8% increase from the 100.8 million units sold in the second quarter, a market research firm said.
Global chip sales rose 5.9 percent 10/29/2007
Global chip sales rose 5.9 percent in September as demand for cell phones and personal computers increased, the Semiconductor Industry Association said.
Applied Material named new CTO 10/26/2007
Stork is a recognized leader in the semiconductor industry and will lead the roadmap for Applied’s silicon technology equipment, oversee integrated technology development across the silicon products,
SanDisk named 25 companies on infringement suit 10/26/2007
The Milpitas, Calif.-based company on Wednesday announced the filing of three patent infringement actions against 25 companies that manufacture, sell and import USB flash drives, compact flash cards, multimedia cards, MP3/media players and/or other removable flash storage products.
Balloon at 22miles high telescopes the Sun 10/26/2007
Placing a telescope at that attitude places it above turbulence, dust, clouds—all the things that satellites are launched above, but at a cost of thousands of dollars compared to millions for a satellite launch.
Apple to encourage 3rd party iPhone applications 10/26/2007
Videos guide developers through basic design and interface issues, then progress to content management, compatibility issues and optimization strategies. Code libraries and example applications are also provided.
Spansion expands into partnership with SMIC 10/25/2007
Spansion has been investing in China for over 10 years, since Spansion's former parent company established the Suzhou final manufacturing facility. Spansion has also added local design centers in Suzhou and Beijing, and sales and marketing offices in Beijing, Shanghai and Shenzhen. Through the new foundry agreement with SMIC, Spansion will have wafer manufacturing capabilities in China.
45nm production ramps up at Intel Fab 32 10/25/2007
''The opening of Fab 32 in Arizona today is a testament to Intel's continued investment in our most strategic asset -- the most advanced, environmentally friendly manufacturing network in the world,'' said Paul Otellini.
Taiwan to build next generation LCD plant 10/25/2007
AU, which supplies panels to Dell Inc and Hewlett-Packard Co , plans to build a next-generation LCD plant to meet new demand for growing flat TVs, and will decide what technology it will use to make panels by the end of the year.
Transmeta to be paid $250M from Intel 10/25/2007
The agreement will grant Intel a perpetual non-exclusive license to all Transmeta patents and patent applications, including any patent rights later acquired by Transmeta, now existing or as may be filed during the next ten years.
Industry leaders predict bottoming in DRAM prices 10/24/2007
Transcend company chairman Peter Su indicated that DRAM prices should be edging to a bottom with a critical drop unlikely to be seen. Citing an historical pattern, demand is expected to be strong in October and November at retail markets.
ChipPAC opens new plant in Shanghai 10/24/2007
STATS ChipPAC Ltd. today announced the grand opening of a second 371,000-square-foot manufacturing facility in Shanghai, China. The company, which claims to be the largest full turnkey assembly and test service provider in China
California fire close electronic plants 10/24/2007
Facilities were set to remain closed at least until Wednesday, and the timing for their reopening will be decided based on progress in containing the fires.
German judge: Nokia need not file another complaint against Qualcomm 10/24/2007
Nokia wanted the German court to rule Qualcomm's patents are exhausted and that it should not be able to charge twice for its patents, billing first chipset suppliers and then also handset makers.
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