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Hitachi to release 1 Tera Byte Drive by 1st Quarter 2007 1/5/2007 Hitachi said it will release a 1TB drive to retail customers in the first quarter of 2007 Taiwan DRAM manufacturers making strong profits in 2006 1/5/2007 Taiwan players of the DRAM business ended last year with strong profits due to the steady rises in DRAM prices,capacity expansion and their migration to 90nm processes. SIS suffers largest revenue drop 1/5/2007 SiS on January 4 reported its self-estimated revenues of NT$421.0 million for last month, down 33.45% on month and 72.85% on year. TI offers DDR3 register chips for memory modules 1/5/2007 Introduced as the industry's first fully-integrated register and phase-locked loop (PLL) for DDR3 registered dual in-line memory modules (RDIMMs) the SN74SSTE32882 has been announced by Texas Instruments. LG to ship Dual HD DVD/ Blue-Ray Disc Player 1/4/2007 LG Electronics will Sell a high-definition video disc player compatible with both the HD DVD and Blu-ray Disc standards Elpida rolls 70-nm DDR2 DRAMs 1/4/2007 Elpida Memory has begun mass production of the DRAM industry's first 1-gigabit and 512-megabit DDR2 SDRAMs using 70-nanometer process technology. Foxconn to locate China HQ in Shanghai 1/4/2007 Foxconn has purchased a 10,000-square-meter parcel of land in an upscale area of Shanghai on which it will construct its China headquarters Qimonda inked Rambus XDR License 1/4/2007 Qimonda AG has signed a license to make use of the XDR memory interface, according to Rambus Inc. MSI to debut "ECG Monitoring" Notebook at CES Show 1/3/2007 Micro-Star International will showcase its first medical notebook that incorporates an electrocardiogram (ECG) monitoring function at the 2007 International CES in Las Vegas next week. VIA to launch C7 processor Ultra-mobile PC at CES Show 1/3/2007 VIA Technologies is seeking to deploy its C7 processor in other markets such as digital consumer electronics, entry-level notebook PCs and thin-client PCs, according to industry sources. Xilinx ships industry's largest 65-nm FPGA 1/3/2007 Xilinx has started to ship a 65-nm LX330 FPGA that is said to deliver 65% more logic than the largest 90-nm device. Samsung sample 16GB 50-nanometer Nand Flash Chip 1/3/2007 Samsung Electronics has begun sampling a 50-nanometer, 16-Gbit NAND flash memory for use in solid-state disk drive applications. Mass volume production will be schedule in the first quarter of 2007. Plastic IC manufacturer setup Fab in Germany 1/3/2007 Plastic Logic has chosen Germany, to build a plant to make flexible active-matrix display backplanes based on polymer semiconductor materials. TSMC to add five more 12-inch taiwan Fab 1/2/2007 Taiwan Semiconductor Manufacturing plans to build five advanced 12-inch wafer plants in Taiwan within the next few years. Taiwan company to fixed earthquake damaged cables 1/2/2007 Taiwan's Chunghwa Telecom said Tuesday two repair ships will soon start fixing undersea cables damaged last week by an earthquake off the island's coast that resulted in a major disruption to telephone and Internet links across Asia iPod "Must-Have" Gift for third Holiday season 1/2/2007 Apple's iPod was the "must-have" Christmas gift for the third consecutive holiday season Winbond to acquire land for R&D site near Hsinchu 1/2/2007 Winbond plans to spend US$21.6 million to acquire commercial land close to the Hsinchu station of Taiwan's High-Speed Rail line Philips sells Automotive Playback Modules operation to Lite-On 12/28/2006 Philips Electronics is selling its Automotive Playback Modules (APM) manufacturing operation to Lite-On of Taiwan DRAM to outperform Flash memory, A-Data said 12/28/2006 A-Data Technology anticipates its DRAM business to outperform sales of NAND flash products in 2007, said company chairman Simon Chen. LCD TV growth to hit brake in 2007 12/28/2006 Rapid price declines will slow LCD TV revenue growth in 2007, according to projections from market research firm iSuppli Corp. Part of Asia Network restored 12/28/2006 Asia's telecommunications services were partly restored on Thursday after earthquakes off Taiwan cut undersea cables and knocked millions of users offline. AMD, New York signed deal on new fab 12/27/2006 AMD signed a Grant Disbursement Agreement with the state of New York on Friday to build a new 300mm wafer fabrication facility in Saratoga County, N.Y. Samsung unveils new mobile DRAM 12/27/2006 Samsung claims it has developed the first 1-gigabit DRAM chip for mobile products, using 80-nanometer process technology. The new chip is at least 20 percent thinner than existing chipsets that use up to two 512-megabit chips, and it uses about 30 percent less power, the company said in a press release. Asia network affected by earthquake 12/27/2006 Telecommunications around Asia were severely disrupted on Wednesday after earthquakes off Taiwan damaged undersea cables, slowing Internet services and hindering financial transactions. Elpida delivers 70nm DDR2 chips 12/27/2006 Elpida Memory has begun mass production of the DRAM industry's first 1-gigabit and 512-megabit DDR2 SDRAMs using 70-nanometer process technology, according to a report.  668  |  669  |  670  |  671  |  672  |  673  |  674  |  675  |  676  |  677

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