Home
News
Products
Corporate
Contact
 
Saturday, April 19, 2025

News
Industry News
Publications
CST News
Help/Support
Software
Tester FAQs
Industry News
Hynix to build 12-inch Nand Flash Fab 3/30/2007
Hynix has signed a land contract at Chongju, North Chungchong Province of South Korea for the construction of a 12-inch fab for NAND flash production.
AMD announces availability of AMD M690 chipset 3/30/2007
AMD announced the availability of its M690 chipset for its Turion64 X2 dual-core mobile CPUs.
TSMC announces 55nm process technology readiness 3/29/2007
TSMC unveiled its half-node 55nm process technology, a 90% linear-shrink process from 65nm including I/O and analog circuits with initial production starting this quarter.
Intel to launch new "Penryn" processor 3/29/2007
Intel will begin producing its next-generation "Penryn" processors by the end of 2007
SIS ink chipset license for Intel Quad Core processor 3/29/2007
Silicon Integrated Systems (SiS) announced today that it has signed a long-term licensing contract with Intel for the manufacture and sale of chipsets for the Intel Core 2 Quad processor with 1333MHz front side bus.
Intel CEO to visit Taiwan 3/29/2007
Intel - CEO Paul Otellini is scheduled to visit Taiwan on March 29 to meet with the company's partners.
Samsung to raise price on 8-Gigabyte Flash chip 3/28/2007
Prices for 8Gb NAND flash parts from Samsung Electronics and Hynix may increase to US$9 due to insufficient capacity.
Transcend to expand manufacturing plant in China 3/28/2007
Taiwan memory-module maker Transcend Information plans to add additional production lines and begin construction of a new fab in the second half of 2007.
Samsung develop 8-GB chip for Mobile Handsets 3/28/2007
Samsung Electronics said it has developed the industry's first eight-gigabyte flash memory card for mobile handsets.
HP slap Acer with Patent Infringement lawsuit 3/28/2007
Hewlett-Packard sued Acer in a US court on Tuesday alleging the Taiwan-based computer maker with unauthorised use of its patented technology.
Kingston to invest in chip packaging and testing company 3/27/2007
Kingston Technology may invest in packaging and testing house Orient Semiconductor Electronics through a private placement in order to strengthen their strategic partnership.
Foxconn to acquire taiwanese memory module company 3/27/2007
Foxconn Electronics said it is interested in consolidating with second-tier memory module makers with Pan Ram International and Unifosa both named as potential candidates.
Acer adds AMD Rev-F CPU to Blade Server 3/27/2007
Acer plans to add blade servers and AMD Rev F Opteron-based servers to its x86 server line-up
IBM unveils super fast chips 3/27/2007
IBM said it has developed a chip capable of transmitting an entire DVD movie in a second, a breakthrough that could make PC faster.
Micron & Qimonda samples DDR3 Memory 3/26/2007
Qimonda and Micron Technology have delivered samples of next-generation DDR3 DRAM ahead of Samsung Electronics.
Intotera Memories opens 2nd Taiwan Fab 3/26/2007
Inotera Memories announced today the opening of its second 12-inch fab in Taoyuan, Taiwan.
Intel to build China 12-inch Fab 3/26/2007
Intel announced plans to build a 12-inch wafer fabrication plant in China
Winbond to dispose 8 inch fab to Vanguard 3/23/2007
No fund raising activities would be required for the acquisition as Vanguard is cash-rich, with the equivalent of NT$12.19 billion on the books as of the last quarter, the company said.
Micron opens Xi-an assembly 3/23/2007
Micron Technology Inc. opened a new manufacturing facility in Xi’an, China this week, the company’s first such facility in the country, designed to assemble and test Micron’s semiconductor products, including dynamic random access memory, NAND flash memory and CMOS image sensors.
AMD employs Chartered on 65nm 3/23/2007
An AMD spokesperson told press that it is currently in full production with Chartered at 90-nm and is in the midst of a transition to 65-nm.
NEC Shanghai to add capacity 3/23/2007
The company currently has one fab in full production, and a second fab, Fab 2, recently started operation and will ramp into mass production later this year. Fab 1C is under construction and scheduled to ramp up in 2008.
Google gPhone vs Apple's iPhone? 3/22/2007
Google isn't commenting directly on leaks from Europe and the United States which describe a low-cost, Internet-connected phone with a color, wide-screen design. Newspaper and blog reports in recent months have Google shopping its phone design to potential mobile phone manufacturing partners in Asia.
Intel Capital invests in China broadband standards 3/22/2007
Legend Silicon (Fremont, Calif.) plans to use the proceeds to develop terrestrial digital TV demodulation IC products that comply with the newly approved China Digital Television Terrestrial Broadcasting standard. Legend Silicon was one of the key contributors to the standard, also known as DMB-TH.
AppleTV sale starts 3/22/2007
The Apple TV has the potential to alter the media landscape and boost Apple's value as a company. Mac users, and many more PC users, would buy the device in the next five years, overtaking set-top box maker TiVo and mail-order DVD renter Netflix.
US electronics industry to grow 3/22/2007
The U.S. tech sector is expected to grow slowly, but steadily, this year, driven by expanding overseas sales.
 666  |  667  |  668  |  669  |  670  |  671  |  672  |  673  |  674  |  675 

CST Inc. Memory Tester DDR Tester
Copyright © 1994 - 2023 CST, Inc. All Rights Reserved