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China forge ahead with TD-SCDMA |
3/21/2007 |
The world's largest mobile phone service operator by number of subscribers is forging ahead with the TD-SCDMA technology even before it has secured a license. China Mobile is seeking bids for contracts reportedly worth $3.1 billion in total.
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SanDisk/Hynix joins technology on new NAND development |
3/21/2007 |
The joint venture would involve equal capital investments by both companies in production capacity at Hynix. The companies' x4 technology cooperation was started between msystems Ltd. and Hynix before the acquisition of msystems by SanDisk last July for $1.35 billion.
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DRAM prices dropped 44% for year |
3/20/2007 |
Average DRAM spot prices across all densities were down 6.5 percent for the seven-day period ended March 16, compared to the previous period, according to Gartner. Average spot prices stood at $3.67 on a 512-megabit basis for the period, down 39 percent since the beginning of 2007.
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Inotera to build more DRAM fab. |
3/20/2007 |
Inotera already has one 12-inch fab, and is outfitting a second. The third fab will come online in 2009, at the earliest. A schedule wasn't available for Fab 4.
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Rambus ruling on hold pending appeal again |
3/20/2007 |
The Federal Trade Commission has temporarily suspended portions of its earlier rulings against Rambus Inc., allowing Rambus to appeal the agency's recent antitrust rulings.
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Digital TV converters available soon |
3/20/2007 |
LG is one of three companies that have developed converter boxes to prevent analog television sets from going dark on Feb. 17, 2009, when U.S. television stations are required to switch to digital.
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China manufacturer enters into $100 PC |
3/20/2007 |
ZhongKe believes the 800MHz Loongson 2E CPU is technically superior to the 366MHz AMD Geode GX2-500 currently used in the project. ZhongKe is also trying to persuade backers of the project that it will be able to facilitate distribution and service in China because of its familiarity with local supply chains.
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Fired Atmel executive fights back |
3/18/2007 |
"As one of Atmel's largest shareholders, I am concerned that the current board and management have undertaken a series of entrenching, self-enriching and value-eroding actions,"
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SIA semi-equipment book to bill flattened |
3/18/2007 |
The three-month average of worldwide billings in February 2007 was $1.58 billion. The billings figure is about two percent under the final January 2007 level of $1.60 billion and 23 percent higher than the February 2006 billings level of $1.28 billion.
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Electro-magnetic paint blocks WiFi theft |
3/18/2007 |
A materials R&D firm announced this week that it has developed a novel way to protect in-building wireless data from unauthorized incursions -- applying its wireless blocking paint to buildings.
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US equity group to acquire JVC |
3/18/2007 |
Matsushita has accepted a bid by Texas Pacific Group (TPG) to purchase its JVC subsidiary and has begun talks to complete the deal by the end of March
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Texas Pacific Group to buy JVC |
3/16/2007 |
Matsushita has accepted a bid by Texas Pacific Group (TPG) to purchase its JVC subsidiary, according to sources close to the companies.
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Samsung samples 8-Gbyte moviNAND |
3/14/2007 |
Samsung Electronics is sending sample of its 8-Gbyte moviNAND embedded flash memory to major mobile electronics manufacturers.
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Elpida joins team in 50-nm DRAM research |
3/14/2007 |
Elpida announced it has entered into a multi-year partnership with Europe-based independent nanoelectronics research center IMEC to perform research and development for beyond 50-nm DRAM process generations.
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Intel to build Microchip plant in China |
3/14/2007 |
China's cabinet has approved a plan by Intel Corp. to invest $2.5 billion in a microchip plant in Dalian, the National Development and Reform Commission said.
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AMD and Intel pushing embedded market |
3/12/2007 |
AMD and Intel are both actively pushing their products in the embedded market, with AMD increasing the number of processors available for industrial PC (IPC) makers while Intel plans for its server platform to hit the telecommunications market in the later half of 2007 and its mobile platform to hit the low-power embedded market.
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