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| TI to enter into e-ID with FRAM memory |
10/1/2007 |
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Texas Instruments' embedded FRAM technology is based on joint development with partner Ramtron International Corp. (Colorado Springs, Colo.), which licensed its nonvolatile FRAM technology to Texas Instruments in 2001. TI's emphasis on speed and storage capacity are among the "high notes" in terms of what the market needs.
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| Huawei to acquire 3Com |
10/1/2007 |
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"We believe that this agreement better positions 3Com to establish itself as a global networking leader, which will benefit our employees, our customers and our partners."
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| AMD launch "Black Edition" Processor |
9/28/2007 |
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AMD unveil its second Black Edition processor, a lower-priced dual core gaming processor targeted at enthusiasts looking to set their own clock speeds.
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| NEC to be delisted in the U.S |
9/27/2007 |
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NEC has disclosed that it was notified by the NASDAQ that its trading would be suspended from September 27, 2007.
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| Nokia ships luxury Cellphones |
9/27/2007 |
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Nokia has started selling a phone designed jointly with Ferrari for about 18,000 euros (about $25,400) at its stores in London, Paris, Hong Kong and Singapore.
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| SanDisk open Shanghai Plant |
9/27/2007 |
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SanDisk has opened a system-in-package (SIP) assembly and test facility in Shanghai, the company's first in the People's Republic of China.
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| Elpida unveil DDR2 1066Mhz chip |
9/26/2007 |
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Elpida announced that it has achieved the world's first ultra-fast 2-Gigabit DDR2 SDRAM featuring a speed of 1066Mbps
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| Foxconn to set up Chinese LED plant |
9/26/2007 |
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Foxconn Electronics has signed a contract with the administration of an industrial development zone in Wuhan, Hubei Province, China, to set up an LED production facility.
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| Intel to reopens Israel Fab |
9/25/2007 |
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Intel plans to re-open its chip factory(Fab-8) in Jerusalem, Israel, after its plans to close the fab in Janurary 2007.
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| Samsung fab not affected by Power Outage |
9/24/2007 |
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Samsung Electronics said all its semiconductor production lines were operating normally after a brief power problem at its main chip plant complex near Seoul, South Korea.
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| Virtium rolls out VLP DDR3 ECC SO-DIMM memory modules |
9/24/2007 |
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Virtium Technology Inc. announced a family of small form-factor Very Low Profile VLP DDR3 Registered ECC SO-DIMM, VLP DDR3 ECC SO-DIMM, VLP DDR3 SO-RDIMM and VLP DDR3 SO-CDIMM ECC memory for embedded systems.
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| Ex-CEO of Infineon to head Grace Semi |
9/21/2007 |
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Ulrich Schumacher, former CEO of Infineon Technologies AG who left the company about three years ago, has taken on the positions of president and CEO at foundry Grace Semiconductor Manufacturing Corp.
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| Acer sees more consolidation in PC market |
9/21/2007 |
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The personal computer industry is in for a wave of consolidation and there will only be room in the market for a few major players, Acer President Gianfranco Lanci said.
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