|
 |
|
| Motorola sold GPS technology for $20 million |
6/3/2005 |
|
SiRF, already an established player in the GPS and navigation spaces, will integrate into its product portfolio Motorola’s existing GPS chip set products, including the MG2000 used in telematics applications and the MG4x00 (Instant GPS) used in cellular handsets and for public safety two-way radio designers.
|
|
|
| Nanya enters into 90nm DRAM production |
6/3/2005 |
|
"With the qualification of advanced DRAM products on 90-nm process technology we have achieved a major milestone towards product and technology leadership and increased DRAM manufacturing productivity,"
|
|
|
| Samsung to enable TV phone with TI partnership |
6/2/2005 |
|
TI supplies Samsung with chips for other devices, such as digital cameras. In January, it announced it had finally made progress on the wireless front, supplying image processors for four Samsung phones. TI hopes the TV phone relationship will lead to a long-lasting bond with Samsung.
|
|
|
| Hitachi and Renesas roll out new 3D package |
6/2/2005 |
|
"The new technology eliminates the need for wire bonding and reduces package thickness by more than 60 percent for the most advanced system-in-packaging (SIP) products,"
|
|
|
| AMD aimed at 50% of X86 market |
6/2/2005 |
|
A recent AMD newsletter aimed at bringing readers "the latest developments in AMD's effort to provide 50% of the world with affordable computing capability and Internet access by 2015."
|
|
|
| Desi Rhoden speaks on state of memory industry |
6/1/2005 |
|
DRAM is a man made commodity and the market is almost entirely driven by supply demand forces in the industry. It is not a business for anyone with a weak heart. Those of us that are in the industry thrive on the innovation and challenge and we have learned that the market continually changes.
|
|
|
| AMD defines market segment for dual core |
6/1/2005 |
|
Advanced Micro Devices today announced the latest addition to its dual-core line, the Athlon 64 X2, which it hopes will do for the company in digital media what its single core processors have done for it in the gaming market.
|
|
|
| Semi Capital seen pull-backs |
6/1/2005 |
|
Worldwide capital spending could fall by 32 percent in the fourth quarter of 2005, as compared to the first quarter, according to IC Insights (Scottsdale, Ariz.).
|
|
|
| Taiwan Fabs quoted longer lead time |
6/1/2005 |
|
The top two foundries, Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) and United Microelectronics Corp. (UMC), have been lengthening lead times for their products as they increase their manufacturing capacity utilization rates due to increased orders.
|
|
|
| Transmeta to sell Crusoe processor line |
6/1/2005 |
|
Under the terms, Transmeta (Santa Clara, Calif.) has agreed to sell, through a combination of asset purchase and licensing agreements, its Crusoe microprocessor technology to Culturecom.
|
|
|
| NAND flash caught up with NOR |
5/31/2005 |
|
The shipment revenue of so-called NAND-type flash memory was roughly equivalent to that of NOR-type flash in the first quarter of 2005, according to market research company iSuppli Corp.
|
|
|
| PowerChip to increase memory production |
5/31/2005 |
|
Huang notes that his company's advantage in DDRII production is its second 300-mm silicon-wafer factory, which will account for 30% to 40% of the factory's total output next month. Also, PSC plans to allocate more than 10% of its capacity at its first 12-inch wafer fab by this June to produce AG-AND NAND flash for Renesas Technology.
|
|
|
| Investment added to Plasma display |
5/31/2005 |
|
The third plant is to be capable of producing 100,000 units per month by the second half of fiscal 2006, ending March 2007, with monthly capacity to increase to 200,000 units by the end of fiscal 2008, the year ended March 31, 2009, Hitachi said.
|
|
|
| Improvement seen in US manufacturing |
5/31/2005 |
|
Semiconductor shipments from U.S. fabs jumped 5.1 percent but remain below the peak reached last summer. With falling memory prices in the spring, this is a substantial increase in the number of parts shipped.
|
|
|
| World's smallest 4-Gbit NAND flash |
5/31/2005 |
|
Samsung's 4-Gbit NAND flash memory was first developed in September 2003 but the move to the use of a 70-nm manufacturing process enables Samsung to produce the industry's smallest memory cell size, the company said.
|
|
|
| Renesas to carve its own path |
5/30/2005 |
|
One of the growing markets for Renesas is MCUs for the automotive market, and currently the company is seeing an interest in dual core microcontrollers in that space. That’s because dual core MCUs can offer system redundancy, something highly valued in the automotive space where consistent performance is so essential.
|
|
|
| PC and Mobile market picking up |
5/30/2005 |
|
According to Handelsbanken this would mean that "actual" semiconductor sales in April were $17.68 billion, up 11 percent compared with April 2004. In turn this would represent a rebound in semiconductor growth.
|
|
|
| DDR2 price cross-over seen |
5/30/2005 |
|
Intel Corp. will introduce more PC core logic chipsets that support the 1066-MHz Front-Side Bus (FSB) and DDR2 677. When this occurs, suppliers will quickly ramp up DDR2 677 production in order to take advantage of the present price premium.
|
|
|
| NEC looking forward to additional 300mm capacity |
5/30/2005 |
|
The company said that the fab could be flexibly expanded depending on the demand. The 300-mm line, which started operation last December at the existing A fab with a monthly capacity of 4,000 wafers, is equipped with facilities for 130- and 90-nanometer manufacturing processes. With the official launch, the company said it plans to expand into the new B fab to reach 6,000 wafers a month by September.
|
|
|
| Hynix and Micron to ramp up NAND flash capacity |
5/27/2005 |
|
Hynix is expected to more than double its NAND flash wafer starts by year-end while Micron Technology will begin volume producing NAND flash on 12-inch wafers, according to sources.
|
|
|
| SMIC takes loan from Chinese Banks |
5/27/2005 |
|
A consortium of Chinese banks has agreed to loan $600 million to Shanghai-based foundry Semiconductor Manufacturing International Corp. to allow the company to expand its 300-mm wafer operations in Beijing.
|
|
|
|
