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Globalfoundries announces 20-nm chip ARM chip 12/15/2011
Globalfoundries and ARM Holdings Plc have announced the tape out of a 20nm chip and have demoed a Cortex-A9 SoC operating at more than 2.5GHz on 28nm technology.
Renesas develops 40-nm flash memory 12/15/2011
Renesas Electronics has said it has developed a 40-nm embedded flash memory intellectual property for implementation at 40-nm and use in automotive applications.
Dram price edge up 10% 12/15/2011
DRAM spot prices have surged over 10% recently due in part to efforts by chip suppliers including Hynix Semiconductor and Micron Technology to defend their prices on the spot market, according to industry sources.
Apple to launch new MacBook Pro 12/14/2011
Apple is likely to launch its new MacBook Pro lineup with a display resolution of 2880 by 1800 in the second quarter of 2012,
PowerASE to delist on Taiwan Stock Exchange 12/14/2011
PowerASE Technology, a Taiwan-based provider of IC packaging/testing services will withdraw its listing on the Emerging Stock Market in Taiwan
Numonyx lends US$133 million to Inotera 12/14/2011
Inotera Memories announced the acquisition of a short-term loan of US$133 million from Netherlands-based Numonyx Holding BV, a wholly owned subsidiary of Micron Technology.
Samsung takes record DRAM share in 3Q11 12/13/2011
Samsung Electronics in the third quarter managed to rise above challenging conditions in the DRAM business to achieve an all-time record-high market share.
DRAM price continues to slide 12/13/2011
DRAM contract prices fell 7-8% sequentially in the second half of November, pushing the price of 2GB DDR3 and 4GB DDR3 modules to US$10 and US17.5,
DRAM maker reduce production by 25% 12/13/2011
Elpida Memory began to cut its DRAM output by 20-25% from the third quarter of 2011, and Nanya Technology, Samsung Electronics and Hynix Semiconductor have been reducing their wafer start orders for commodity DRAM parts.
US Solar maker to cut 1300 jobs 12/12/2011
US-based solar firm MEMC Electronic Materials (MEMC) will reduce the company's global workforce and accelerate operating cost reductions in 2012 and beyond.
Foxconn November revenues hit record 12/12/2011
Foxconn Electronics has reported non-consolidated revenues of US$10.17 billion for November
TSMC November sales down 12/12/2011
Taiwan Semiconductor Manufacturing Company (TSMC) saw its sales decrease sequentially in November 2011.
SanDisk ship 700 million to retail channels in 2011 12/9/2011
SanDisk has forecast that overall shipments of its NAND flash-related products to retail channels worldwide will top 700 million units in 2011, up more than 15%.
UMC revenues down 23% in November 12/9/2011
United Microelectronics Corporation (UMC) saw its revenues decline about 22.75% on year in November 2011, which marked the foundry's seventh-straight month of annual decreases.
TSMC to begin third-phase construction at Fab 15 12/9/2011
Taiwan Semiconductor Manufacturing Company (TSMC) will soon break ground for the third phase construction of its new 12-inch wafer plant in central Taiwan.
Western Digital to open Taiwan R&D center 12/8/2011
Western Digital is set to establish an R&D center in Hsinchu, Taiwan, focusing on solid state drives (SSD) and will recruit about 50 technicians from Taiwan.
RIM unveils BlackBerry 10 OS 12/8/2011
RIM has unveiled its new platform, the BlackBerry 10, at the 2011 BlackBerry Developer Conference Asia.
Samsung to build chip Fab in China 12/8/2011
Samsung Electronics has issued a statement disclosing plans to set up a flash memory chip plant in China.
Microsoft to offer its own "App store" 12/7/2011
Microsoft on Tuesday began wooing developers for a February opening of its first "app store" for computers powered by the US technology giant's Windows software.
Intel and Taiwan co-develop new memory chip 12/7/2011
Intel has joined hands with a top Taiwan research institute to develop a new generation of memory chips for use in lighter, energy-saving smartphones and tablets.
Micron unveil 20nm NAND flash 12/7/2011
Intel and Micron Technology have jointly announced a 20nm, 128Gb multilevel-cell (MLC) NAND falsh device.
Powerchip mass producing driver ICs at 90nm 12/6/2011
Powerchip Technology has announced mass production of the foundry segment's 90nm high-voltage process technology for small- to medium-size driver ICs used in mobile device applications, utilizing capacity at its existing 12-inch facilities.
Samsung Austin ramps new 12-inch fab 12/6/2011
Samsung Austin has announced the completion of its 300mm automated fab, S2.
Price of solar wafers steadies at US$1.10 12/6/2011
The price drop of solar wafers has been leveling off, according to industry sources. Since the beginning of November, the average selling price (ASP) of solar wafers has been steady.
Foxconn to build 8.5G flat panel production line in Brazil 12/5/2011
Market speculations indicate that Foxconn plans to build an 8.5G LCD panel production line in Brazil, employing advanced panel manufacturing technology from Sharp.
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