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Samsung release eMMC controller 1/10/2012
Samsung and Hynix have released 2012 orders for embedded MMC (eMMC) controller ICs to major Taiwan-based suppliers of NAND flash device controllers.
TSMC report 4Q11 sales increase 1/10/2012
TSMC saw its consolidated revenues amount to US$3.5 million in the fourth quarter of 2011.
Lenovo to unveil Smart-TV at CES 1/10/2012
Lenovo has unveiled its own-brand smart TVs during a product presentation prior to the opening the CES trade show
LG to unveil Google TV at CES 1/9/2012
LG Electronics plans to roll out two lineups of smart TVs, with one lineup of products running on Google TV platform and another on its own system developed in house, according to LG.
Acer to launch Aspire ultrabook 1/9/2012
Acer has unveiled its latest ultrabook with the Aspire S5, an ultra-slim device that measures only 15mm at the maximal point.
UMC reports 4Q11 sales decline 1/9/2012
Revenues at United Microelectronics Corporation (UMC) amounted to US$809.6 million in the fourth quarter of 2011.
Samsung sees record profit in 4Q11 1/6/2012
Samsung has estimated its operating profits for the last quarter of 2011 at about US$4.5 billion, up 22.4% on quarter and 73.3% on year.
Sony unveils high speed write memory card 1/6/2012
Sony said it will begin selling memory cards with write speeds of 125 Mbps, the fastest in the industry.
Ultra-thin laptops will take centre-stage at CES 1/6/2012
Ultra-thin laptops will take centre-stage alongside new software and smartphones at the annual Consumer Electronics Show (CES), a gadget extravaganza that officially opens on Tuesday in Las Vegas.
Rexchip Electronics post 25% increase in revenues for December 2011. 1/5/2012
Rexchip Electronics has reported a 25% sequential increase in revenues for December 2011.
ChipMOS develop alternative to gold bumping 1/5/2012
Chipbond Technology and ChipMOS Technologies have both adopted Cu/Ni/Au bumps for LCD driver IC packaging to significantly reduce gold use, according to the companies.
Samsung to expand NAND flash China plant 1/5/2012
Samsung Electronics plans to set up a new NAND flash wafer plant in China reportedly has been approved by the South Korea government.
Elpida and Toshiba in partnership talk 1/4/2012
Elpida Memory and Toshiba are in talks to integrate business operations, with the Japan government playing a key role in making it happen.
PTI buys advanced packaging company 1/4/2012
Powertech Technology (PTI) has acquired a 12-inch electrochemical deposition (ECD) system from Nexx Systems.
VIA unveils Mini-ITX embedded motherboard 1/4/2012
VIA Technologies has announced the VIA VB7009 embedded Mini-ITX motherboard. Measuring only 17x17cm, the VIA VB7009 Mini-ITX is a flexible embedded board for POS and kiosks.
Powerchip lands order for MCP chip 1/4/2012
Powerchip Technology has received orders for 100,000 512Mb and 1Gb MCPs (multi-chip packages) made of 40nm-based NAND flash chips and low-power Mobile RAM chips.
ChipMOS predict 10-15% revenue growth in 2012 1/3/2012
ChipMOS Technologies expects its revenues to increase 10-15% to top US$690 million in 2012,
UMC launches specialized 0.11-micron aluminum process 1/3/2012
United Microelectronics (UMC) has launched a specialized 0.11-micron aluminum process manufactured at its 8-inch fabs
Intel to announce 40 new server processors 1/3/2012
Intel is set to launch 40 new processors including those for its upcoming Romley platform, in the first half of 2012 with the company to release 20 models each quarter.
$25 ARM board to bring ubiquitous presence of cheap computers 12/29/2011
The aim was to build a computer so cheap, it could be handed out to children like textbooks.
TSMC to consider new Fab in New York State 12/29/2011
While the nature of TSMC's potential investment in New York state is unclear, the foundry giant is presumably considering building one or more fabs there.
Amazon released holiday sales data 12/29/2011
Amazon customers purchased millions of Kindle Fires and millions of Kindle e-readers. And 2011 was the best holiday ever for the Kindle family, as customers purchased over 1 million Kindle devices each week.
New iPad models on Jan. 26 at the Macworld|iWorld Conference 12/29/2011
iPad models will stick with the 9.7-inch display size found on the iPad and iPad 2, although they sport a higher resolution at 1536 x 2048 with dual LED light bars for a sharper and brighter image, and a quad-core A6 processor.
Breakthroughs at UT can double solar efficiency 12/28/2011
"Plastic semiconductor solar cell production has great advantages, one of which is low cost. Combined with the vast capabilities for molecular design and synthesis, our discovery opens the door to an exciting new approach for solar energy conversion, leading to much higher efficiencies."
NTT Docomo JV with 5 others on Mobile chip development 12/28/2011
It reached a basic agreement with five companies— Fujitsu Ltd., Fujitsu Semiconductor Ltd., NEC Corp., Panasonic Mobile Communications Co. Ltd. and Samsung Electronics Co. Ltd.—to establish a fabless joint venture to develop and sell semiconductors for handsets and other mobile devices.
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