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| Apple buys Anobit |
1/12/2012 |
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Apple said it had bought Israel's Anobit, a maker of flash storage technology whose chips it already uses in gadgets such as the iPad.
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| LG unveil 84-inch 3D TV |
1/11/2012 |
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LG Electronics will unveil the world's largest 3D Ultra Definition (UD) TV at the Consumer Electronics Show (CES) in Las Vegas.
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| Intel, Motorola inked mobile partnership |
1/11/2012 |
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Intel and Motorola Mobility have announced that the two companies have entered into a multi-year, multi-device strategic relationship that includes smartphones which Motorola will begin shipping later this year using Intel Atom processors and the Android platform.
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| Foxconn reports record high December revenues |
1/11/2012 |
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Foxconn Electronics (Hon Hai Precision Industry) reported unconsolidated December revenues of NT$316.944 billion (US$11 billion), a 3.17% increase on month and 29.53% increase on year
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| Samsung release eMMC controller |
1/10/2012 |
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Samsung and Hynix have released 2012 orders for embedded MMC (eMMC) controller ICs to major Taiwan-based suppliers of NAND flash device controllers.
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| LG to unveil Google TV at CES |
1/9/2012 |
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LG Electronics plans to roll out two lineups of smart TVs, with one lineup of products running on Google TV platform and another on its own system developed in house, according to LG.
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| Acer to launch Aspire ultrabook |
1/9/2012 |
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Acer has unveiled its latest ultrabook with the Aspire S5, an ultra-slim device that measures only 15mm at the maximal point.
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| UMC reports 4Q11 sales decline |
1/9/2012 |
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Revenues at United Microelectronics Corporation (UMC) amounted to US$809.6 million in the fourth quarter of 2011.
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| Samsung sees record profit in 4Q11 |
1/6/2012 |
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Samsung has estimated its operating profits for the last quarter of 2011 at about US$4.5 billion, up 22.4% on quarter and 73.3% on year.
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| Ultra-thin laptops will take centre-stage at CES |
1/6/2012 |
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Ultra-thin laptops will take centre-stage alongside new software and smartphones at the annual Consumer Electronics Show (CES), a gadget extravaganza that officially opens on Tuesday in Las Vegas.
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| ChipMOS develop alternative to gold bumping |
1/5/2012 |
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Chipbond Technology and ChipMOS Technologies have both adopted Cu/Ni/Au bumps for LCD driver IC packaging to significantly reduce gold use, according to the companies.
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| VIA unveils Mini-ITX embedded motherboard |
1/4/2012 |
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VIA Technologies has announced the VIA VB7009 embedded Mini-ITX motherboard. Measuring only 17x17cm, the VIA VB7009 Mini-ITX is a flexible embedded board for POS and kiosks.
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| Powerchip lands order for MCP chip |
1/4/2012 |
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Powerchip Technology has received orders for 100,000 512Mb and 1Gb MCPs (multi-chip packages) made of 40nm-based NAND flash chips and low-power Mobile RAM chips.
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