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Renesas offers embedded mobile flash 12/19/2011
The technology offers 20 years of data retention and progam-erase endurance of 125,000 cycles, Renesas said. The memory is based on MONOS (metal oxide nitride oxide silicon) technology.
ST put contactless die test on wafer 12/19/2011
Conventional a probe card connected to automatic test equipment (ATE) makes contact with the bond pads on each die in turn and runs a series of tests. Under EMWS each die contains an antenna and the ATE supplies power and communicates with the IC wirelessly.
JEDEC ready to release 3D memory stack IC standard 12/19/2011
The industry consensus is that LPDDR2 will run out of bandwidth before WideIO memories are commercially available. LPDDR3 (which is a linear evolution of LPDDR2) is expected to fill this gap by supporting higher operating frequencies while maintaining power efficiencies of LPDDR2. The 800MHz LPDDR3 will feature 50% more bandwidth than a 533MHz LPDRR2 while retaining the equivalent pin count as LPDRR2.
$300 Million infusion to boost Twitter's status 12/19/2011
By limiting its shareholders to a small group of private investors, Twitter doesn't have to disclose how much revenue it brings in. The research firm eMarketer estimates Twitter will generate close to $140 million in ad revenue this year and $260 million in 2012.
Freescale adopts Macronix Flash chip 12/16/2011
Macronix International has announced a collaboration with Freescale Semiconductor, and its Qorivva MPC5645S MCU, which provides a cost-effective and powerful platform for high-resolution color graphics and analog functions for the automotive dashboard displays market.
PTI to invest in Logic/IC Test company 12/16/2011
Powertech Technology (PTI), a Taiwan-based provider of DRAM packaging/testing services, plans to acquire common shares in Greatek Electronics
Apple to launch 7.85-inch iPad in 2012, 12/16/2011
Apple is likely to launch a 7.85-inch iPad prior to the fourth quarter of 2012 in addition to a new iPad scheduled to be released at the end of the first quarter.
Globalfoundries announces 20-nm chip ARM chip 12/15/2011
Globalfoundries and ARM Holdings Plc have announced the tape out of a 20nm chip and have demoed a Cortex-A9 SoC operating at more than 2.5GHz on 28nm technology.
Renesas develops 40-nm flash memory 12/15/2011
Renesas Electronics has said it has developed a 40-nm embedded flash memory intellectual property for implementation at 40-nm and use in automotive applications.
Dram price edge up 10% 12/15/2011
DRAM spot prices have surged over 10% recently due in part to efforts by chip suppliers including Hynix Semiconductor and Micron Technology to defend their prices on the spot market, according to industry sources.
Apple to launch new MacBook Pro 12/14/2011
Apple is likely to launch its new MacBook Pro lineup with a display resolution of 2880 by 1800 in the second quarter of 2012,
PowerASE to delist on Taiwan Stock Exchange 12/14/2011
PowerASE Technology, a Taiwan-based provider of IC packaging/testing services will withdraw its listing on the Emerging Stock Market in Taiwan
Numonyx lends US$133 million to Inotera 12/14/2011
Inotera Memories announced the acquisition of a short-term loan of US$133 million from Netherlands-based Numonyx Holding BV, a wholly owned subsidiary of Micron Technology.
Samsung takes record DRAM share in 3Q11 12/13/2011
Samsung Electronics in the third quarter managed to rise above challenging conditions in the DRAM business to achieve an all-time record-high market share.
DRAM price continues to slide 12/13/2011
DRAM contract prices fell 7-8% sequentially in the second half of November, pushing the price of 2GB DDR3 and 4GB DDR3 modules to US$10 and US17.5,
DRAM maker reduce production by 25% 12/13/2011
Elpida Memory began to cut its DRAM output by 20-25% from the third quarter of 2011, and Nanya Technology, Samsung Electronics and Hynix Semiconductor have been reducing their wafer start orders for commodity DRAM parts.
US Solar maker to cut 1300 jobs 12/12/2011
US-based solar firm MEMC Electronic Materials (MEMC) will reduce the company's global workforce and accelerate operating cost reductions in 2012 and beyond.
Foxconn November revenues hit record 12/12/2011
Foxconn Electronics has reported non-consolidated revenues of US$10.17 billion for November
TSMC November sales down 12/12/2011
Taiwan Semiconductor Manufacturing Company (TSMC) saw its sales decrease sequentially in November 2011.
SanDisk ship 700 million to retail channels in 2011 12/9/2011
SanDisk has forecast that overall shipments of its NAND flash-related products to retail channels worldwide will top 700 million units in 2011, up more than 15%.
UMC revenues down 23% in November 12/9/2011
United Microelectronics Corporation (UMC) saw its revenues decline about 22.75% on year in November 2011, which marked the foundry's seventh-straight month of annual decreases.
TSMC to begin third-phase construction at Fab 15 12/9/2011
Taiwan Semiconductor Manufacturing Company (TSMC) will soon break ground for the third phase construction of its new 12-inch wafer plant in central Taiwan.
Western Digital to open Taiwan R&D center 12/8/2011
Western Digital is set to establish an R&D center in Hsinchu, Taiwan, focusing on solid state drives (SSD) and will recruit about 50 technicians from Taiwan.
RIM unveils BlackBerry 10 OS 12/8/2011
RIM has unveiled its new platform, the BlackBerry 10, at the 2011 BlackBerry Developer Conference Asia.
Samsung to build chip Fab in China 12/8/2011
Samsung Electronics has issued a statement disclosing plans to set up a flash memory chip plant in China.
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