Home News Products Corporate Contact

Friday, January 24, 2025

News Industry News Publications CST News Help/Support Software Tester FAQs

Dual core notebook processor to go integrated graphics 8/25/2008 Both companies see an opportunity to reduce power consumption while boosting graphics performance with the integrated parts, something particularly useful for notebooks. German battery manufacturer fights to make up loss production 8/25/2008 A fire at Batterie-Montage-Zentrum (BMZ) GmbH in Karlstein, Germany, during the night of August 20 has caused a damage in the double-digit million euro range. A production hall and a warehouse were destroyed. Intel expects to ship 20 Million Atom Processor 8/22/2008 Intel is expanding its Atom processor capacity and anticpates to ship up to 20 million units this year. U.S to drop Tariff for Hynix Dram products 8/22/2008 Hynix said the U.S. Commerce Department has decided to remove a 23.78% punitive tariff on the import of its dynamic random access memory Nand Flash prices continues to fall 8/22/2008 Mainstream 8Gb and 16Gb NAND flash chips prices are expected to fall by 10% in late August. Sony announced High Resolution Portable PSP 8/21/2008 Sony will launch a new PlayStation Portable in October with a high-resolution screen and a built-in microphone that enables it to be used as a telephone. Cadence withdraw bid for Mentor Graphics 8/21/2008 Cadence Design Systems Inc. has withdrawn its proposal to acquire Mentor Graphics for $1.6 billion. Intel unveils new Internet TV processor chip 8/21/2008 Intel announced that it will combine the Internet and television with its new CE3100 processor launched at the Intel Developer Forum. Intel to rebrand Centrino Atom product 8/21/2008 Intel has rebranded all its Centrino Atom brand name for Mobile Internet Device (MID) products ProMos report 2nd Quarter smaller losses 8/21/2008 ProMOS Technologies announced that its losses in the second quarter have shrunk by about 30%, making it the most improved company among Taiwan's DRAM players in the quarter. TI adds more platform for DLP Applications 8/20/2008 Texas Instruments has unveiled a new platform designed to ease the development of applications for digital light processors (DLP). Intel unveils its own SSD Drive 8/20/2008 Intel have launched a family of solid-state drives claiming significant performance advances over its many competitors. Hynix unveiled 16GB DDR3 DIMM at IDF 8/20/2008 Hynix announced that it is using MetaRAM's new DDR3 technology in its next generation R-DIMMs, including the world's first 16GB 2-rank DIMM Memory. Hynix adds more investment stake at ProMos 8/19/2008 Hynix Semiconductor will become the second-largest institutional shareholder at Taiwan 's ProMOS. SIS to postpone spin-off till next year 8/19/2008 Silicon Integrated System (SiS) has announced it will postpone the planned spin-off of three subsidiaries from the original schedule of September 1 this year to January 1 next year. IBM unveils 22-nm SRAM Memory 8/19/2008 IBM and its development partners have claimed their first working SRAM cell implemented in a 22-nm manufacturing process. The SRAM cell was built at its 300-mm fab in Albany, New York. Elpida unveils 16GB FBDIMM Memory 8/18/2008 Elpida Memory announced a 16GB Fully Buffered DIMM (FB-DIMM) that is composed by 2Gb of DDR2 components. Toshiba unveils 32GB embedded NAND flash 8/18/2008 Toshiba announced the launch of the 32GB embedded NAND flash memory modules that are thelargest density yet announced, with the modules also having full compliance with the e-MMC and eSD standards. Elpida delivers 2.5Gbps DDR3 chip 8/18/2008 Elpida Memory have developed a 1Gb DDR3 SDRAM that delivers a speed up to 2.5Gbps Intel unveils smaller version of SSD 8/15/2008 Intel has introduced a smaller version of its solid-state drive for mini-notebooks, an emerging PC category that's showing strong market growth worldwide. Intel help push CPU unit shipment growth 8/15/2008 The PC processor business grow 3.1 percent in unit shipments in the June quarter with Intel drove most of the growth, but intense price competition drove revenues down 4.5 percent, according to International Data Corp. said. Rambus to cut headcount on cost saving 8/15/2008 Rambus Inc. said it will reduce its workforce by approximately 90 positions or about 21 percent of its headcount and will take a restructuring charge of about $4.0 million in the next two quarters. Applied Material reports lower earnings 8/14/2008 Applied Materials Inc.'s third-quarter net income dropped 65% on lower sales and margins. Sandisk see new applicants for NAND flash 8/14/2008 The NAND flash memory market is still seeing a horrific downturn, as the industry is saddled with too much capacity Philips unload all TSMC shares 8/14/2008 Royal Philips Electronics has sold approximately 383 million shares of common stock in Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC).  609  |  610  |  611  |  612  |  613  |  614  |  615  |  616  |  617  |  618

Copyright © 1994 - 2023 CST, Inc. All Rights Reserved