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| Global hard-disc shipment to double by May 2011 |
3/7/2011 |
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Hard Disk drive shipments in the first quarter of 2011 are expected to see a sequential drop of 4-5% to only about 155-165 million units as notebook vendors face inventory pressure generated by weak sales over the year-end holidays world-wide.
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| Intel standardize all-in-one PC specification |
3/3/2011 |
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Intel is cooperating with Taiwan-based all-in-one PC makers including Mitac International, Micro-Star International (MSI) and Elitegroup Computer Systems (ECS) to push standardization for all-in-one PCs
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| Apple unveil iPad2 |
3/3/2011 |
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Apple has introduced the iPad 2, the next generation of its device for browsing the web, reading and sending email, enjoying photos, watching videos, listening to music, playing games, reading ebooks and much more.
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| AMD to debut Hudson chipsets |
3/2/2011 |
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AMD has contracted Taiwan Semiconductor Manufacturing Company (TSMC) to manufacture its Hudson-series chipsets, which support the new Brazos platform.
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| AMD introduces Fusion CPU in China |
3/2/2011 |
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AMD introduce its new Fusion APU and unveil more than 30 new products with executives from brands Hewlett-Packard (HP), Dell, Lenovo, Toshiba, Samsung Electronics, Sony and Fujitsu as well as Taiwan-based brands Acer, Asustek and Micro-Star International (MSI).
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| Apple aim to ship 6.5 million iPads in 1Q11 |
3/2/2011 |
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Apple plans to take deliveries of 6-6.5 million iPads, including iPad 2, in the first quarter of 2011 and aims at a total shipment volume of 40 million iPads for 2011.
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| Toshiba & Sony inked agreement for fab equipment transfer |
3/1/2011 |
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Toshiba and Sony Semiconductor Kyushu (SCK) have executed definitive agreements based on the non-binding MOU signed earlier between Toshiba and Sony for the transfer from Toshiba to SCK of certain semiconductor fabrication equipment.
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| Fujitsu to use ARM IP in new processor design |
2/28/2011 |
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Fujitsu Semiconductor will incorporate the latest technology from ARM Holding plc—including ARM's Cortex-A15 processor into its SoC offerings under the terms of a comprehensive license agreement between the companies.
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| TSMC chief says no overcapacity concerns |
2/28/2011 |
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Taiwan Semiconductor Manufacturing Company (TSMC) only builds capacity to meet the needs of its customers, and the company's advanced processing technology also encourages it to ramp up new capacity, according to chairman and CEO Morris Chang.
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| Intel ships fixed 6-series chipsets to Taiwan makers |
2/28/2011 |
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Asustek Computer, Gigabyte Technology, Micro-Star International (MSI) and Elitegroup Computer Systems (ECS) have all received small-volume shipments of fixed 6-series chipsets from Intel and will begin delivery of new P67, H67 and H61-based motherboards shortly.
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| Nvidia unveils Dual-core graphic card |
2/25/2011 |
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Nvidia is expected to unveil its dual-GPU GeForce GTX 590 graphics card in mid-March 2011 at the earliest and AMD will release its Radeon HD 6990 a month later.
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| Rexchip to produce Mobile DRAM |
2/25/2011 |
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Rexchip Electronics will start trial production of mobile DRAM products employing Elpida Memory's designs in May 2011.
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| Flextronic cut staff at Taiwan operation |
2/25/2011 |
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Flextronics International has laid off some of its staff working in the desktop and all-in-one (AIO) PC units of its plant in Taiwan due to lower-than-expected performance in 2010.
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| Ramtron hurted by IBM's slow ramp up |
2/24/2011 |
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As reported, IBM appears to be struggling with its foundry ramp for Ramtron. In 2009, Ramtron entered into a foundry services agreement with IBM. The companies planned to install Ramtron’s FRAM semiconductor process technology in IBM's Burlington, Vermont, advanced wafer manufacturing facility.
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| Google to introduce Cloud Connect for MS Office |
2/24/2011 |
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The company says it takes Office files, uploads them to Google's servers and gives them a unique Web address so they and can be accessed through Google Docs from any Internet-connected device. The files can also be accessed from within Office.
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| NEC Medias, thinnest smartphone |
2/24/2011 |
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Thin continues to be in for new smartphones: the NEC Medias N-04C, launched by NTT DoCoMo in Japan on Thursday, is about 8 millimeters thick.
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| Light Squared's proposed 4G will jam GPS |
2/24/2011 |
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4G networks - a good thing, right? A super-fast data connection, access to anything, anywhere. But maybe not so great, says GPS manufacturer Garmin, if you want to know exactly where you are.
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| Nand market collapse is coming |
2/23/2011 |
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But don’t look now, the NAND flash party may be nearly over. Hynix, Micron, Samsung and Toshiba have or will ramp up new NAND fabs-a move that could cause a capacity glut and falling prices. At present, NAND sells for $1.60 per gigabyte. By mid-2012, NAND is expected to fall and hit $0.65 per gigabyte, a 40 percent drop,
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