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iPod originator filed for IPO |
8/13/2004 |
A little-known fabless chip company that provides the silicon and software platform for the Apple iPOD has registered for an initial public offering of shares on the Nasdaq market in hopes of raise $75 million.
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Intel delays next generation chipset |
8/13/2004 |
"We wanted to make sure we addressed a quality issue we found in a late stage of validation," Anand Chandrasekher, vice president of Intel's Mobile Platforms Group, told financial analysts Wednesday (August 11). "We have since found that issue and fixed it."
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Notebook manufacturer pulls back estimate |
8/13/2004 |
The company's CEO, Ray Chen, who had been bullish about growth for the notebook sector this year, trimmed his estimate for the global notebook market to 43million to 44 million units from 47 million.
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Britons spending more time on e-life |
8/12/2004 |
The reports states that in the past four year consumers have increased their time online eight-fold and tripled the length of mobile phone use, while still managing to watch more TV and listen to more radio.
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Wire bonder provider lowers forcast |
8/12/2004 |
"Our revised guidance is based on our customers’ latest indications regarding wire bonder capacity. Some customers are now more cautious about the timing of future demand,"
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Fairchild Semi to expand in China |
8/12/2004 |
Fairchild Semiconductor (South Portland, Maine) has added power design centers in Shanghai and Shenzhen and increased headcount and capacity at its less than year-old Suzhou facility.
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MS to offer XP-Lite to Asian countries |
8/12/2004 |
Starter Edition will initially ship on inexpensive PCs in Malaysia, Thailand and Indonesia. The Redmond, Wash.-based developer already had rolled out localized Windows XP-Office XP bundles in the first two nations, and Microsoft had previously announced it was negotiating with the three governments
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Lehman downgrades Intel outlook |
8/11/2004 |
"Heading into 2Q04, we had signaled some reservations on our outlook, however, we were left surprised by the impact of Intel's higher production yields prompting a need for it to slow wafer starts and hence lower fab utilization levels and margins,"
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China defy global standards, forms own |
8/11/2004 |
The moves, if successful, could have a dramatic impact on the global electronics industry. While the standards initially are aimed at the indigenous Chinese market, the long-term goal is to export these products -- and thus the standards -- outside of China.
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ISSI ventures into non-memory products |
8/11/2004 |
Already, just over half of his engineers are working on non-memory projects, such as smart cards, wireless chip sets and application specific controllers.
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China's silicon pioneer died at 70 |
8/11/2004 |
In 1980, Chen walked away from a coveted position at the national Chinese Academy of Sciences to launch a high-tech development company in the Zhongguancun area of Beijing.
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PCI Express chipsets to gain position |
8/10/2004 |
VIA Technologies and Silicon Integrated Systems (SiS) are expecting higher chipset shipments in third quarter as the level of non-Intel chipsets inventories going to increase reported by Taiwan motherboard makers.
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Embedded 64bits to grow on handsets |
8/10/2004 |
Customer-specific, cell-based 64-bit embedded processor market will thrive, with forecasted growth over that timeframe of 82.7%, according to In-Stat/MDR.
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Cambridge Display filed S-1 registration for IPO |
8/10/2004 |
The number of shares and the timing of the IPO has not been finalized, but the offering is expected to raise no more than $40.25 million, according to the S-1 registration. The filing is dated July 30, 2004.
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VIA settles dispute with MediaTek |
8/9/2004 |
VOS agreed to pay MediaTek a royalty of US$25 million upon execution and US$5 million per year in each of the following five years. In return, MediaTek agreed to grant VIA a perpetual license to any of its copyrights and trade secrets as well as a five-year license to any of its existing intellectual property
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Infineon to do 300mm and 90nm DRAM at Winbond |
8/9/2004 |
Under the terms of the additional agreement, Munich-based Infineon will transfer its 0.09-micron DRAM trench technology and 300mm production know-how to Winbond, based in Taipei.
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