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| NEC to build its first 300mm fab. |
11/6/2003 |
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NEC Electronics and its subsidiary, NEC Yamagata Ltd., are to build the 300-mm wafer line on the first floor of NEC Yamagata's fab with the total investment of about 60 billion yen (about $540 million).
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| DRAM makers uniformly optimistic |
11/5/2003 |
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Meanwhile, in the DRAM market, there is growing optimism about market prospects in 2004, although it is tempered by concerns over a lack of a technology or density transition next year, according to iSuppli analyst Nam Hyung Kim.
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| FCC lays Hollywood a hand on HDTV rules |
11/5/2003 |
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The “broadcast flag” is a digital code that can be embedded into a digital broadcasting stream. It signals DTV reception equipment to limit the indiscriminate redistribution of digital broadcast content.
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| Intel to use hi-k dielectric by 2007 |
11/5/2003 |
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As silicon dioxide is thinned to about five atomic layers in order to turn on the transistor more quickly, electrons have tunneled through the oxide layer, causing wasted power during the "on" state. The switch to a high-k material will reduce power leakage while the transistors are switching.
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| eMemory announce novel memory cell structure |
11/5/2003 |
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The companies are all keenly interested in what appears to be a novel cell structure that has the characteristics of EPROM -- used to store program data code -- but uses a simple, logic-based process that is more easily ported from fab to fab.
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| Taiwan set to build large LCD panel |
11/4/2003 |
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The president of Chi Mei Optoelectronics (CMO) Ho Chao Yang said the company will build seventh generation TFT-LCD plant, skipping the sixth-generation TFT LCD lines. CMO will spend US$9 billion over about five years on three plants that will make flat screens used in televisions.
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| Nano-technology can achieve molecular logic and memory |
11/4/2003 |
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Tour said his work demonstrates that today's chip makers can achieve increases of two to three orders of magnitude in chip density by leveraging the lithographic tools they already have to form random-access addresses into arrays of nanoscale molecular memories.
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| Philips to go direct sales on IC |
11/4/2003 |
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Philips Electronics N.V.'s semiconductor division said it plans to jettison its manufacturers' representatives in North America, replacing them with an in-house sales force.
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| Next generation Xbox will have IBM processor |
11/4/2003 |
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Microsoft is expected to use an advanced version of IBM's PowerPC processor for its next Xbox, according to Richard Doherty, president of research firm Envisioneering Group.
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| China reverse policy on foreign owned export business |
11/4/2003 |
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The move, which pushes China another step closer to complying with World Trade Organization regulations, will enable foreign companies to export products without first creating a separate relationship with a Chinese import/export agent.
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| Kingmax provides 512MB PC3200 SODIMM for Desknotes |
11/3/2003 |
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Kingmax Semiconductor now leads the industry with the release of its high-capacity 512MB DDR400 (PC-3200) SO-DIMM, which uses Kingmax's proprietary Tiny BGA technology to package 16 32M*8 DRAM chips.
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| Electronic pill to help diagnose human |
11/3/2003 |
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University of Glasgow to test a sensor-laden diagnostic device that is swallowed to collect data as it passes through a patient's intestines. The laboratory-on-a-pill will later move to clinical trials with live subjects.
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| Apple pinpoints Oxford Semiconductor on system fault |
11/3/2003 |
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"Apple has identified an issue with external FireWire hard drives using the Oxford 922 bridge chip-set with firmware version 1.02 that can result in the loss of data stored on the disk drive. Apple is working with Oxford Semiconductor and affected drive manufacturers to resolve this issue."
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| Semi shipment picking up, said SIA |
11/3/2003 |
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Worldwide sales of semiconductors reached $14.4 billion in September, up 6.5 percent from $13.6 billion in August, according to the Semiconductor Industry Association (SIA).
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| Intel roll out new Wi-Fi Chip |
10/30/2003 |
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Intel has rolled out its Pro/Wireless 2100A chip, which will give Centrino notebooks an 802.11a connection.
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