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| chipmakers settle patent infringement suit |
1/21/2004 |
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International Rectifier Corp., Hitachi Ltd. and Renesas Technology Corp. said they have settled all outstanding lawsuits involving patent infringement allegations among the three companies.
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| Too early to conclude on SARS outbreak |
1/20/2004 |
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Despite the measures taken by the Guangdong provincial government, it's still too early to conclude whether SARS would break out this year,said SAR Experts.
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| Motorola adds more stake in SMIC |
1/20/2004 |
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Motorola took a significant stake in SMIC this week, selling the foundry its MOS-17 wafer facility in Tianjin, China, in exchange for SMIC shares
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| IBM to add 15,000 new jobs |
1/20/2004 |
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IBM will hire 15,000 new employees--50 percent more than originally planned--in areas such as software and services because of a rebound in the economy.
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| Mosel to seperate itself form ProMos |
1/16/2004 |
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Mosel's said the company planned to sell its DRAM business including 100 percent of US subsidiary United Memories Inc and 50 percent of Mosel Vitelic (US) Corp. to ProMOS for US$120 million. The fund created will enable the company to repay its debts.
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| Philips shifted bipolar production to China |
1/16/2004 |
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The move is part of a long-term supply agreement under which Philips has outsourced power semiconductor assembly and test services to PSi. Transfers will start this quarter and extend to 2005, according to PSi.
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| Nokia signed IT service contract to IBM |
1/16/2004 |
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"We have chosen to outsource the management of our desktop IT environment as part of an initiative to focus on core business infrastructure and IT activities and to improve service flexibility and cost efficiency, enabling a higher level of business agility," said Gordon Jack, VP of Nokia's business infrastructure unit.
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| Hot Spots going free |
1/16/2004 |
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The Wi-Fi program — along with Schlotzsky's free use of in-restaurant PCs — is now mandatory for new franchisees. And many existing Schlotzsky's proprietors are installing Wi-Fi service in their sandwich shops.
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| Intel brings out Wi-Fi chip with advanced technology |
1/16/2004 |
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According to Josh Newman, director of engineering at Intel's wireless group, the company took advantage of a 20,000-square-foot facility in San Diego with multiple access points to develop a WLAN solution that could maximize throughput and connectivity in the face of multipath reflections.
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| Engibous hands CEO title to Templeton |
1/16/2004 |
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Templeton, 45, will become the president and CEO of Texas Instruments effective May 1, while Engibous, who is 50 years old, will retain the position of chairman.
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| Teradyne reduces loss on higher sales |
1/15/2004 |
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"We ended 2003 with very strong growth," said George Chamillard, chairman and CEO, in a statement. "With this momentum, coupled with our cost reduction efforts, we expect to deliver solid profit growth in the first quarter of 2004."
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| CEA and MIT to sponsor Media Lab symposium at Campus |
1/15/2004 |
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Consumer Electronics Association (CEA) and the Media Lab jointly sponsor a symposium on MIT's Cambridge, Mass., campus that will focus on trends and technology issues affecting the consumer electronics industry.
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| Chartered strikes partnership with IBM |
1/15/2004 |
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Chartered, which operates five fabs in Singapore, is expected to begin 90-nm SOI production for IBM by mid-2005, according to the announcement.
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| Intel invested into nano-memory |
1/15/2004 |
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Intel will support nano-related technology efforts at Nanosys for possible use in memory products. According to the agreement, Nanosys and Intel will work together exclusively on certain areas of memory-related technologies.
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| TI's DVR chip first approved by Microsoft |
1/14/2004 |
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That means TI's chips are the only ones of their kind that device makers can use to record in the Windows Media format. That distinction could become important as television manufacturers look for ways to let consumers digitally record TV shows without being able to distribute them in violation of copyrights.
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| Xilinx send advisory on defected chips |
1/14/2004 |
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The affected parts were manufactured using improper solder material that may cause random upset of device configuration, the company said in a statement.
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