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PalmOne delivers profitable quarter 9/21/2004
PalmOne Inc. reported a quarterly profit compared to a loss a year ago on a 62 percent jump in revenue, spurred by solid sales of its Treo 600 mobile phone and other handheld digital devices.
Ask Jeeves adds new features 9/21/2004
Jeeves announced a list of significant upgrades to their Web site, including an improved search engine and a "personal Web" space where users can permanently store bookmarks and save search results for later reference.
Sony to sell smaller PS2 9/21/2004
Sony unveiled a smaller, cost cutting PlayStation 2 to match up with the trend of continous drop in price in video-game consoles. The units will go on sale worldwide next month.
Stratus introduces less costly fault-tolerant server 9/20/2004
Stratus Technologies Inc. is making its fault-tolerant server more affordable.
Hypermemory by ATI 9/20/2004
ATI Technologies has announced a memory technology that cuts PC system costs by using system memory for graphics processing.
Samsung to make 2G DDR2 9/20/2004
Samsung said it has achieved development breakthrough of the world's first 2Gb DDR2 SDRAM using existing, 80-nanometer micro-processing technology.
PMC-Sierra cut guidance 9/20/2004
PMC-Sierra Inc. warned that it would miss its earlier guidance on third-quarter sales. The company now expects revenue of $71 million to $73 million rather than its earlier guidance of $86 million to $92 million.
ATI develop Hypermemory to reduce PC cost 9/17/2004
ATI Technologies has developed a memory technology that enables visual processors to use system memory for graphics processing, thus lessening dependence on graphics memory and lowering system costs.
TSMC shipped Million 0.13 micron wafers 9/17/2004
TSMC said that the company has produced and shipped more than 1 million 8-inch-equivalent wafers with transistors measuring 0.13 micron across
Japanese researchers develop new capacitor for advanced DRAM 9/17/2004
A joint research team from Hitachi Ltd and Elpida Memory Inc has developed a capacitor intended for use in next-generation DRAM chips with a linewidth of 65 nanometers.
Infineon agrees to $160 million fine in U.S. DRAM price-fixing probe 9/16/2004
Infineon agrees to $160 million fine in U.S. DRAM price-fixing probe
TSMC claims lead in 0.13-micron, low-k production 9/16/2004
TSMC said that it has cumulatively produced and shipped more than one million 8-inch equivalent wafers with circuits made using 0.13-micron processing
LG & IBM disband PC division 9/16/2004
LG IBM PC Co Ltd, a PC business unit, announced Sept 14 that it would disband, leading to the end of the joint venture of LG Electronics and IBM Korea.
Microsoft issue new patch 9/15/2004
Microsoft has issued a patch to fix the security flaw, and urges its customers to use a new utility to locate the computer applications that are vulnerable
Japanese researchers succeeds in creating MRAM wafer 9/15/2004
In what could be a breakthrough for MRAMs, Japanese researchers have successfully fabricated a tunneling-magnetoresistance device on an 8-inch silicon wafer with a magnesium oxide tunnel barrier layer.
Micron samples 288Megabit RLDRAM 9/15/2004
Micron announced qualification of the 288 megabit (Mb) reduced latency DRAM II (RLDRAMĀ® II) products now available in volume production.
Transmeta ship Efficeon processors 9/14/2004
Transmeta had begun shipping limited numbers of Efficeon TM8800 processors in September
Chinese phone company to deploy 3000 cyber cafes 9/14/2004
China's second-largest mobile phone company plans to open 3,000 Internet cafes by the end of the year, exerting stronger state control over a sector once dominated by private enterprise,
Infineon to license Hard-Disk Technology from Hitachi 9/14/2004
Infineon has signed a long-term license agreement with Hitachi on read channel technology for hard drive applications
Motorola reportedly building cell phone R & D center in Beijing 9/13/2004
Motorola said it plans to invest $90 million to build a research and development center in Beijing.
Chartered Launches 0.13micron, 0.11micron, 90nm Processes at 300mm Fab 9/13/2004
Chartered Semiconductor Manufacturing has achieved functional 0.13micron 300mm wafers from its Fab7.
NEC Electronics Announces New Advanced Memory Buffer 9/13/2004
NEC Electronics announced that it has developed a new Advanced Memory Buffer (AMB) device for use in fully buffered dual-inline memory modules (FB-DIMMs).
Samsung Introduces Cell Phone with HDD 9/13/2004
Samsung announce a cell phone with a HDD inside, the SPH-V5400, at the ITU Telecom Asia 2004 conference held Sept 6-11 at Pusan, Korea.
European supply tighthen while Asia is flat 9/10/2004
DDR availability in Europe is said to be poor, with players believing that there are some production issues at a number of original manufacturers and that some customers are on allocation.
Samsung starts production of 512Mb DDR on advanced process 9/10/2004
This time the beginning of mass production in Seoul, South Korea, for 512Mbit DDR SDRAM chips on 300mm wafers using a 90nm process.
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