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Intel introduces 3G Xeon with 1.5MB cache 7/15/2003 Intel released a new version of its 3.06GHz Xeon that packs an additional 1MB of cache for workstations. Rambus's revenue rises, but profit tumbles 7/15/2003 Rambus announced lower profit on its second-quarter earnings due to increased costs and expenses. But its revenue climbs 23 percent as royalties and contract sales grew. NEC announced 10G Ethernet module 7/14/2003 NEC announced the release of a 10 Gigabit Ethernet module that could allow network technicians to provide a single 10G bit/sec link between two boxes, instead of tying together multiple Gigabit lines with link aggregation technologies. Toshiba, Elpida venture in next generation memroy 7/14/2003 Toshiba and Elpida Memory plan to work together to make a memory chip for digital home appliances that they say will be eight times quicker than today's fastest chips. AMD, Fujitsu combined flash memory business 7/14/2003 Advanced Micro Devices Inc. and Fujitsu Ltd. formed a new venture called FASL LLC that combined their flash memory businesses. Sun pushes back the 2nd design blade server release 7/14/2003 Sun Microsystems pushes the release of its second blade server design a few months back than early scheduled. The thin system based on an Athlon processor will be released by year-end. Cisco Systems introduces Wireless B media adapter 7/14/2003 Cisco Systems introduces Wireless-B Media Adapter along with Sony's RoomLink media adapters that can be used as Wi-Fi access point to make connections between a PC and a stereo or a television besides built-in cable capacility. The adapter is sold at $200 each. Toshiba setup "discrete device" design center 7/11/2003 Toshiba announced it would establish a new "engineering" company dedicated to provide support for its discrete devices AMD launch aggressive sales in China 7/11/2003 Advanced Micro Devices has launched a sales push in China and aims to grow at least twice as fast as the overall market, its China marketing chief said Applied Materials to cut 2,000 jobs 7/11/2003 Applied Materials is planning to cut 2,000 more jobs in an effort to reduce cost. Infineon under investigation by EC 7/11/2003 The European Commission has launched an investigation into Portugese state aid for Technicos-Fabrico de Semiconductores SA, a subsidiary of Infineon Technologies IBM setup chip design center in Israel 7/10/2003 IBM announced the establishment of a new center in Israel that will provide technology design services for advanced chip applications. Rambus unveiled New XDR Memory 7/10/2003 Rambus Inc. today provided more details of its next-generation memory interface technology, formerly known as Yellowstone Sony to recall Vaio Laptop 7/10/2003 Sony announced it is recalling 18,000 Vaio laptop computers for faulty assembly of the modem, which could cause a minor electric shock to users Matsushita unveil FRAM using 0.18 micron process 7/10/2003 Matsushita Electric Industrial today unveiled an embedded ferroelectric RAM using the 0.18-micron process technology Kingston shipping DDR500 memory module 7/10/2003 Kingston launched its first PC4000 memory module using DDR500 SDRAM chips Chartered Semi ink deal with Infineon 7/9/2003 Chartered Semiconductor unveiled today a deal to build chips for Germany's Infineon Technologies AG Toshiba offers new light-weight Notebook 7/9/2003 Toshiba is tuning up its smallest portables by launching two new Portege notebooks based on Intel's Pentium M processor Intel buys optical network chip company 7/9/2003 Intel will boost its optical networking processor lineup with the purchase of West Bay Semiconductor. Microsoft to support AMD "Alchemy" Solutions 7/8/2003 AMD today announced Microsoft has released a Board Support Package for the AMD Alchemy Solutions DBAu1500 development board SMIC buys stakes in Motorola 's China fab 7/8/2003 SMIC has swapped $260 million in shares to buy a stake in Motorola 's MOS-17 fab in Tianjin VIA launch mobile CPU 7/8/2003 Via Technologies today launched its mobile processor , a low-power 1GHz targeting the slim and light notebooks. TSMC details 130nm & 90nm processes 7/8/2003 Taiwan Semiconductor Manufacturing Co, Ltd has made public the current state of 130nm and 90nm processes. Philips unveil new I2C chip 7/8/2003 Philips Electronics launched its parallel to serial interface I2C bus controller to operate at 400kHz and at low voltages of 3.3V to 2.5V. Microsoft moves more US jobs to India 7/7/2003 Microsoft is starting to shift U.S.-based jobs to India as it seeks to lower technical support and development costs.  838  |  839  |  840  |  841  |  842  |  843  |  844  |  845  |  846  |  847

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