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Power consumption might void Moore's Law |
12/12/2002 |
While high-k dielectrics and clever circuit design may help keep the industry on its traditional curve of doubling device densities every two to three years, those solutions are likely to run out of steam by the end of this decade.
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Looking for your year end bonus ? |
12/11/2002 |
On average, Taiwan companies from all industries will give out an average of 1.3-months extra pay as year-end bonuses before Chinese New Year on February 1, the poll found.
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Andy Grove talks about economy and technology |
12/11/2002 |
Grove pointed to a 6 percent unemployment rate, possible war in Iraq and economic meltdown in South America as potentially destabilizing factors to the economic health of the industry at large.
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Hynix announce 500MHz graphic DDR chip |
12/11/2002 |
Hynix vice president of worldwide marketing, said the high speed DDR-I graphics chip will provide high performance at a 10% cost advantage over DDR-II graphics units.
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New start foundry names COO |
12/11/2002 |
Brunner was most recently general manager of Siemens' Electronic Manufacturing Center in Vienna, Austria.
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TSMC provides advanced product design libraries |
12/10/2002 |
The new library program provides both third party and TSMC-developed libraries, which are tuned for a variety of process technologies including TSMC's most advanced NexsysSM 90 nanometer process for system-on-chip (SoC) design.
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China to sign technology agreement with US |
12/10/2002 |
The agreement symbolizes growing research and commercial ties between Chinese government agencies and U.S. companies and universities. Chinese officials have forged research deals with several universities on technology research, including the University of Maryland.
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Infineon breaks up with ProMos |
12/10/2002 |
Infineon said Tuesday that it will stop buying DRAM chips from ProMOS as of January 1, 2003, and will not transfer any more technology to the venture beyond .11 micron.
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Micron introduce 'Q-Flash', conpatible to 'StrataFlash' |
12/10/2002 |
"As a drop-in replacement, this non-volatile memory device provides networking and communications customers with an efficient, alternative source, requiring no additional software or hardware changes to an application's design," said Jerry Johnson of Micron.
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SST offers small Flash package for Bluetooth |
12/10/2002 |
The Micro-Packages will be aimed primarily at the Bluetooth wireless space, where manufacturers are crying for smaller and lower-cost alternatives to existing packages.
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Acer's new BenQ label hits big |
12/9/2002 |
BenQ, the consumer brand of Acer Electronics, sets a new record of 1.9 million units of mobile phone shipment last month.
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China to be the largest notebook producer next year |
12/9/2002 |
The profit margin getting lesser making these Taiwanese companies quickly shift the notebook production at their China-based facilities rather than produce here in Taiwan that usually the overhead cost more.
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PC shipment will recover but takes different shape |
12/9/2002 |
"While business spending has been slow to recover, we believe it will pick up in the first half of 2003, and market drivers like portable adoption, wireless networking, broadband adoption, new designs, media convergence and TCO improvements will support moderate growth."
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AT&T,Intel and IBM form Wi-Fi company |
12/6/2002 |
AT&T, Intel and IBM, announced they are creating a new company, Cometa Networks, that will provide broadband, wholesale, wireless Internet access nationwide
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Walmart selling $199 PC in store |
12/5/2002 |
Wal-Mart is offering a $199 computer targeting novices PC user looking for a way onto the Internet as well as high-end users wanting a second PC.
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AMD upbeat with 4th quarter revenue |
12/5/2002 |
AMD will raised its revenue guidance for the fourth quarter, citing better-than-expected demand for its microchips used in personal computers and its flash memory products.
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Kentron unveiled QBM DDR 400 Module |
12/5/2002 |
Kentron Technologies Inc, unveiled Quad Band Memory (QBM) technology for DDR400 modules, available now for licensing by chip and module makers
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