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| Micron to cut workforce |
2/19/2003 |
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Micron Technology announced plans to cut approximately 10 percent of its staff to battle the prolong sluggish of the technology market.
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| AMD, ASE joint developed Flip-Chip Packaging |
2/18/2003 |
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Advanced Micro Devices Inc. and Advanced Semiconductor Engineering Inc. (ASE) have signed a deal to jointly develop technologies for flip-chip assembly on organic packages for microprocessor chipsets, the companied announced today.
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| Manufacturing index in NY drops |
2/18/2003 |
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The manufacturing index in New York State fell in February to the lowest level in four months, the Federal Reserve Bank of New York said Tuesday.
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| Chips sales expected to rise |
2/18/2003 |
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Demand for PCs, cell phones,digital cameras and wireless systems could boost industry revenue 20% in 2003, amid the continued economic recovery and a possible war, reported by a research firm.
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| Cisco launches new ad |
2/18/2003 |
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Cisco is launching a $150 million global marketing campaign to raise awareness of the company and boost sales. The ad campaign will appear in print, on television and, and on the Internet.
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| PC shipments may rise in 2003 |
2/18/2003 |
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PC shipments will post a modest increase for 2003 despite the continuous slow economy, according to a new report by Gartner Dataquest.
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| Rambus speed up its memory interconnection technology |
2/17/2003 |
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Rambus Inc. disclosed its new Redwood high-speed logic bus interface. It claims data rates of up to 6.4GHz or 10 times faster than the current highest speed 667MHz processor front side buses, the company reported.
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| Toshiba makes flash memory deals |
2/17/2003 |
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Toshiba reportedly said it is making deals to sell flash memory chips based on M-Systems Flash Disk Pioneers Ltd.'s flash memory capacity-doubling technology as well as to work with Infineon Technologies AG on a new flash technology.
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| Wafers shipment on the rise |
2/17/2003 |
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Silicon wafer shipment worldwide rose sharply in 2002, while revenue grew at a modest rate, according to a new report from a semiconductor industry group.
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| Legend to expand utilizing Taiwan IT technology |
2/14/2003 |
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IDC recently released the list of top-selling personal computer (PC) brands in the non-Japan Asia in the fourth quarter of last year. Legend of mainland China remained at the top of the list, followed by three U.S. brands: HP, IBM, and Dell.
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| Unemployed engineers protested H-1B visa |
2/14/2003 |
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A group of unemployed high-tech workers demonstrated against the U.S. government's H-1B visa program on Wednesday (Feb. 12) outside a Dallas hotel where the IEEE-USA's board was holding its quarterly meeting.
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| Would embedded DRAM replace SRAM cache? |
2/14/2003 |
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IBM's memory evangelists are predicting an increase in the instances where embedded DRAM replaces conventional SRAM, especially in high-performance processors such as Intel Corp.'s Itanium line.
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| iSuppli forcast continue glut in IC supply |
2/14/2003 |
What is clear is that the overcapacity, low utilization rates and depressed pricing that has dogged semiconductor manufacturing for the last two years are likely to linger for some time to come.
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| Nokia to reduce some staff |
2/13/2003 |
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The infrastructure arm of Nokia plans to reduce the number of R&D sites and centralize work into larger entities within the organization to increase efficiency and reduce costs.
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| Intel to compete in TI's sweet spot |
2/13/2003 |
The XScale-based PXA800F runs at 312MHz with 4Mbytes of integrated Intel On-Chip Flash memory and 512Kbytes of SRAM. In addition, the GSM/GPRS networks-aimed technology includes a 104MHz signal processor using Intel's MicroSignal architecture with integrated On-Chip Flash and SRAM.
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| New package plant opened in China |
2/13/2003 |
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The facility will be operated by Sawtek Inc., a wholly owned subsidiary of TriQuint Semiconductor, to provide assembly, test, mark, tape and reel support for TriQuint's products that serve the worldwide cell phone market.
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| Progress reported in FRAM production |
2/13/2003 |
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The 32Mbit FRAM is made on 0.2-micron processing, which provides a 1.875 square micron cell size on a 96mm2 die. Toshiba claimed this is half the die size of other FRAMs with the same size cell.
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| Chartered to shut older fabs |
2/13/2003 |
"In order for us to have room to grow we have to resize capacity of older technologies," said Chia Song Hwee, president. "We are reducing mature capacity in order to make room for growth in 0.18- and 0.13-micron."
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| BenQ and Philips formed optical JV |
2/12/2003 |
"This joint venture concludes the series of measures taken to bring Optical Storage back to profitability and will position us well for continued participation in the data segment in a profitable way and further strengthen the successful DVD+RW platform in the future."
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| Applied Material : "Unknown Outlook hurts equipment market" |
2/12/2003 |
Chipmakers are reluctant to sign purchase orders these days. "The number of orders I have that are missed is mind boggling," said Bronson. "We don’t' see them going to competitors," Morgan added. "We just don't know if they are going to come in or not."
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| January good to foundry business |
2/12/2003 |
Following the upbeat announcement of UMC on increased business yesterday, TSMC announced that its sales for the month saw a 15.8 percent sequential increase, which company CFO Harvey Chang attributed to advanced sales for the Chinese New Year.
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